LED device

Abstract

The invention discloses an LED device, which comprises a substrate and an LED chip, wherein the LED chip comprises a substrate and a luminous part; two poles of the LED chip are arranged on the back of the substrate; and the two poles of the LED chip are jointed on a pad of the substrate. The LED device has the advantages of simple structure, convenient installation, thin thickness after encapsulation, high light emitting efficiency, good luminous effect, good heat dissipation performance, high reliability and long service life.

Description

technical field [0001] The invention relates to a semiconductor packaging structure, in particular to an LED device. Background technique [0002] The existing LED device is to fix the LED chip on the substrate, wherein the LED chip includes a light-emitting part and a bottom substrate, the two poles of the LED chip are located above the LED chip, and the LED chip is bent by the gold wire extending from the two poles of the LED chip. After that, it is electrically connected to the pad of the substrate. [0003] However, the way in which the LED chip of the prior art is connected to the substrate after bending the gold wire has the following disadvantages: [0004] 1. Due to the gull-wing structure of gold wire bending, the thickness of the LED chip after packaging is thicker, which is not conducive to the installation and integration of the chip; [0005] 2. Since the gold wire is thinner, the current passing through the LED chip is smaller under the same voltage, which wi...

AI Technical Summary

Problems solved by technology

[0004] 1. Due to the gull-wing structure of gold wire bending, the thickness of the LED chip after packaging is thicker, which is not conducive to the installation and integration of the chip;

[0005] 2. Since the gold wire is thinner, the current passing through the LED chip is smaller under the same voltage, which will affect the light output efficiency of the LED chip;

[0006] 3. Due to the poor thermal conductivity of the thin gold wire, it is not conducive to the heat dissipation of the LED chip;

[0007] 4. Since the LED chip is electrically connected to the external circuit after being bent by the gold wire, the gold wire may break during transportation or circuit connection extrusion, which will affect the reliability of the circuit connection after the LED chip is packaged

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