Epoxy resin formulations
A technology of epoxy resin and novolac epoxy resin, which is applied in the direction of printed circuit, electrical components, etc., and can solve the problems such as difficulty in meeting specifications
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Embodiment 1
[0200] A curable epoxy resin composition is prepared by mixing:
[0201] 100 ± 5 parts by weight of DEN438, a semi-solid epoxy novolak resin, which is the reaction product of epichlorohydrin and novolac resin, and is commercially available from the Dow Chemical Company;
[0202] 33 ± 3 parts of phosphorus-containing novolak epoxy resin, which is a bisphenol-A-novolak resin modified by methyl-dioxaphosphaphenanthrene-oxide;
[0203] 32 parts of diaminodiphenylsulfone;
[0204] 4±0.5 parts of 2-phenylimidazole accelerator;
[0205] 25 ± 5 parts Dowanol TM PM, a propylene glycol methyl ether;
[0206] 1 ± 0.5 parts boric acid; and
[0207] 20 ± 5 parts methyl ethyl ketone.
[0208] The exact ratios of the various components are given in the table below:
[0209]
[0210] The varnish formulation was used to impregnate a glass braid (style 7628 from Porcher / finish 0731), passing the impregnated glass braid through a horizontal processor oven (Caratsch, oven 3 meters long)...
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