Three-plate mini-type heat radiator

Abstract

The invention discloses a three-plate mini-type heat radiator. The heat radiator comprises an upper cover, a water passing layer and a sealing layer, wherein the upper cover is rectangle and is transversely provided with an upper apopore and an upper inhalant pore up and down; one side of the longitudinal lower face of the upper cover is fixed with a heat-dissipation layer uprightly arranged; thewater passing layer is rectangular and corresponding to the upper cover, and is transversely provided with a middle apopore and a middle inhalant pore up and down; one side of the longitudinal upper face of the water passing layer is provided with a rectangular groove; the rectangular groove contains a heat dissipation layer below the upper cover, a strip-shaped groove is arranged between the rectangular groove and one side end of the middle inhalant pore; the position on the bottom of the rectangular groove, which is adjacent to the to end of the water passing layer, is provided with a slit penetrating up and down; a back groove is arranged at the same side of the rectangular groove and on the back of the water passing layer, the back groove is communicated with the slit, and a strip-type concave ditch is arranged between the back groove and one side end of the back of the middle inhalant pore; the sealing layer is corresponding to the upper cover, and is transversely provided with alower apopore and a lower inhalant pore; and the upper cover is buckled on the water passing layer, the heat-dissipation layer at the lower face of the upper cover is positioned in the rectangular groove of the water passing layer, and the sealing layer is covered on the lower face of the water passing layer.

Description

technical field [0001] The invention relates to a three-piece miniature radiator, which belongs to the field of optoelectronics, relates to the heat dissipation and refrigeration of power optoelectronics and microelectronic devices, and is mainly used to solve the heat dissipation problem of high-power semiconductor laser single tube and array devices. Background technique [0002] Heat dissipation technology is a thorny problem often faced by optoelectronic and microelectronic devices, especially for semiconductor devices, because temperature has an important impact on the physical properties of semiconductor materials such as band gap, band edge absorption and emission band, which is reflected in the macroscopic view. That is, the basic optoelectronic characteristics of the device, such as power-current characteristics, spectral curves, etc., will change greatly with temperature. For example, for high-power semiconductor laser array devices, as the temperature of the device...

AI Technical Summary

Problems solved by technology

[0002] Heat dissipation technology is a thorny problem often faced by optoelectronic and microelectronic devices, especially for semiconductor devices, because temperature has an important impact on the physical properties of semiconductor materials such as band gap, band edge absorption and emission band, which is reflected in the macroscopic view. That is, the basic optoelectronic characteristics of the device, such as power-current characteristics, spectral curves, etc., will change greatly with temperature. For example, for high-power semiconductor laser array devices, as the temperature of the device increases, the slope efficiency decreases and the output The power is reduced and the central wavelength is red-shifted. These changes in characteristics are extremely unfavorable for practical applications.

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