Connection method of reactive sintered silicon carbide ceramics

Abstract

The invention relates to a connection method of reactive sintered silicon carbide ceramics, belonging to the method for connecting ceramics. The invention solves the problems that soldered ceramics forms thermal stress between the ceramic and soldering materials to affect the stability of soldered ceramics and the high-temperature resistant performance of organic adhesive is poor. The method comprises the following steps of: surrounding the space formed by the surfaces to be connected of the silicon carbide ceramics by a plaster board to form a cavity, filling the slurry for preparing the silicon carbide ceramics in the cavity, drying, sintering and mechanically processing to obtain the silicon carbide ceramics. In the method, the basal body and the formed reactive sintered silicon carbide are difficult to distinguish by observing the connecting surface part and the boundary part of the connected silicon carbide ceramics with a handheld microscope; the connection part is similar to the basal body in the fracture strength; and the observation on the connection part by the handheld microscope shows that the connection part is tightly connected with the basal body without defects.

Description

technical field [0001] The invention relates to a method for connecting ceramic parts. Background technique [0002] With the continuous improvement of space reconnaissance requirements, the diameter of the reflector is increasing, which brings a series of technical problems. Firstly, as the self-weight of the reflector increases with the exponential power of the caliber, the difficulty of manufacturing the reflector also increases; secondly, with the increase of the caliber of the reflector, the volume of the equipment required for the manufacture of the reflector also increases, to a certain extent Thirdly, as the diameter of the mirror increases, the yield of the mirror prepared by the traditional method also decreases, which leads to an increase in the manufacturing cost. [0003] Under the current scientific research situation, the commonly used methods for ceramic parts mainly include brazing method, inorganic glue bonding method, organic glue bonding method, etc., am...

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Problems solved by technology

[0006] The purpose of the present invention is to solve the problem that brazing connection of ceramic parts will form thermal stress between ceramics and solder, which will affect the stability of ceramic welded parts, and the high temperature resistance of organic glue in the bonding method is poor. A kind of connection method of reaction sintered silicon carbide ceramic parts

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