Self-adhesive mica tape winding wire
A mica tape, self-adhesive technology, applied in the direction of flat/ribbon cables, insulators, manufacturing motor generators, etc., can solve the problems of complex structure, damage to environmental protection, unreasonable consumption of raw materials, etc., to avoid environmental damage Influence, reduce the effect of process steps
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Example Embodiment
[0027] Example 1:
[0028] Please see figure 1 ,in figure 1 The conductor 1 given in is a flat copper conductor with a thickness of 5.5mm and a width of 15.5mm. The conductor 1 is combined with an insulator. In this embodiment, a self-adhesive layer is bonded on one side. The first mica tape 2 of 21 is used as an insulator, and the first mica tape 2 is wrapped on the conductor 1 in a stacking manner. When wrapping, the side with the self-adhesive layer 21 faces away from the conductor 1, that is, The self-adhesive layer 21 faces outward. The thickness of the first mica tape 2 is 0.09mm, and the overlap rate is 66%. The so-called overlap rate can also be called the overlap rate, which refers to the ratio of the width of the overlapped portion to the width of the first mica tape 2. The wrapping rate is also a preferred value obtained by the applicant after repeated attempts, because too much overlap will cause unnecessary (unreasonable) waste of the first mica tape 2, otherwise it...
Example Embodiment
[0031] Example 2:
[0032] Please see figure 2 The film 3 is wrapped around the flat copper conductor 1, the film 3 is made of a polyimide film with a thickness of 0.04mm, and then the surface of the polyimide film is wrapped on one side with a self-adhesive layer 21 The first mica tape 2, that is, in this embodiment, the film 3 and the first mica tape 2 together constitute the insulator. Wherein, the thickness of the conductor 1 is 1 mm, and the width is 2.5 mm, the thickness of the first mica tape 2 is 0.09 mm, the lamination rate of the first mica tape 2 is 50%, and the rest are the same as the description of Embodiment 1.
Example Embodiment
[0033] Example 3:
[0034] Please see image 3 The encapsulation layer 4 is sintered and bonded outside the flat conductor 1 made of copper with a thickness of 3mm and a width of 10mm, and then is wrapped around the encapsulation layer 4 and bonded with a self-adhesive layer 21 on one surface The first mica tape 2. It can be seen that, in this embodiment, the encapsulation layer 4 and the first mica tape 2 together constitute an insulator combined outside the conductor 1. Among them: the thickness of the first mica tape 2 is 0.08mm, the lamination rate of the first mica tape 2 is 50%, and the encapsulation layer 4 is a composite film coated with fluorine 46 (F46) on one or both sides. The imine film, and the rest are the same as those described in Example 1.
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