Heat dissipation device for notebook computer

A notebook computer and cooling device technology, applied in the direction of indirect heat exchangers, electrical digital data processing, lighting and heating equipment, etc., can solve the problems of notebook computers such as reduced thickness and weight, inability to use heat sinks and fans, and limited space. To achieve flexible design and installation, solve the problem of heat dissipation, and achieve the effect of large heat dissipation

Inactive Publication Date: 2010-12-01
SOUTH CHINA UNIV OF TECH
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

However it has limited space and cannot use larger heatsinks and fans
[0003] At present, there is a method of using ordinary heat pipes plus heat sinks and fans to implement notebook computer chip

Method used

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  • Heat dissipation device for notebook computer
  • Heat dissipation device for notebook computer
  • Heat dissipation device for notebook computer

Examples

Experimental program
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Embodiment Construction

[0021] In order to further understand the present invention, the present invention will be further described below in conjunction with the accompanying drawings and embodiments. It should be noted that the embodiments do not constitute a limit to the protection scope of the present invention.

[0022] Such as figure 1 , 2 , 3, and 4, a cooling device for notebook computers is a flat-plate loop heat pipe cooling device, which includes a screen 7, an evaporation chamber 1, a liquid phase pipeline 2, a vapor phase pipeline 6, a flexible pipeline 3, a condensation Section 5; the evaporation chamber 1 and the chip 8 are closely connected by heat-conducting silica gel; the evaporation chamber 1 is provided with a sintered wick 13, a compensation chamber 11 and a steam chamber 12; the sintered wick 10 is located in the middle of the evaporation chamber 1 and fills the evaporation chamber 1 longitudinally , the two sides of the sintered capillary core 10 are respectively provided wit...

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PUM

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Abstract

The invention discloses a heat dissipation device for a notebook computer, which comprises a screen, an evaporation cavity, a liquid phase pipeline, a vapor phase pipeline, a flexible pipeline and a condensation section. The evaporation cavity is tightly connected with a chip by heat conducting silica gel; the condensation section consists of a bent pipeline loop and is positioned at the back of the screen of the notebook computer, and two joints of the pipeline loop of the condensation section are communicated with the vapor phase pipeline and the flexible pipeline respectively to form a circulation pipeline which is provided with working fluid, and the flexible pipeline is positioned at a connection part of a host of the notebook computer and the screen, and is made from a corrugated metal hose. Heat energy on the chip of the notebook computer is transferred to the condensation section at the back of the screen under the condition of no additional power, and the back of the screen is used as a heat dissipation surface so as to quickly dissipate the heat energy to the environment, and the flexible pipeline cannot be broken off when the notebook computer normally opens and closes. Thus, the stable operation of the notebook computer is guaranteed.

Description

technical field [0001] The invention relates to a heat dissipation device, in particular to a novel heat dissipation device for a notebook computer with high efficiency, energy saving, environmental protection and simple structure. technical background [0002] In early notebook computers, the heat of the chip was mainly taken to the external environment through natural convection through the heat sink. But as the performance of desktop computers is getting higher and higher, in order to narrow the performance gap between notebook computers and desktop computers. At the same time, due to mobile phones, portable printers, networks and other mobile offices, the performance requirements of notebook computers are also getting higher and higher. High-performance processors and accessories are used in notebook computers. On the other hand, it is required to be light, thin, and easy to carry, so the heat generation density rises rapidly. For a long time, heat dissipation has bee...

Claims

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Application Information

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IPC IPC(8): G06F1/20
CPCF28D15/0266
Inventor 汪双凤陈金建
Owner SOUTH CHINA UNIV OF TECH
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