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LED (Light-Emitting Diode) module and LED illumination device

A technology of LED modules and LED chips, which is applied in the field of lighting to achieve the effect of soft light and eliminating glare

Inactive Publication Date: 2012-03-28
SHENZHEN REFOND OPTOELECTRONICS
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

[0004] The purpose of the embodiment of the present invention is to provide an LED module, aiming to solve the problem of insufficient uniform illumination and serious glare of the existing LED module

Method used

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  • LED (Light-Emitting Diode) module and LED illumination device
  • LED (Light-Emitting Diode) module and LED illumination device
  • LED (Light-Emitting Diode) module and LED illumination device

Examples

Experimental program
Comparison scheme
Effect test

Embodiment 1

[0021] Such as figure 1 As shown, the LED module provided by the embodiment of the present invention includes a substrate 10 and a plurality of LED chips 11 with die bonding wires on the substrate 10 , and the LED chips 11 are bonded and fixed on the substrate 10 with thermally conductive adhesive. The substrate 10 is an aluminum substrate, a copper substrate or a ceramic substrate with high thermal conductivity, and the surface of the metal substrate must be insulated. The LED chip 11 may be a blue light chip, an ultraviolet light chip, or a combination of a blue light chip and a red light chip of the same wavelength band or different wavelength bands.

[0022] In the embodiment of the present invention, the fluorescent cover frame 12 is fixed on the upper surface of the substrate 10 by integral injection molding, or fixed on the upper surface of the substrate 10 by bonding. When the fluorescent cover frame 12 is disposed on the upper surface of the substrate 10 by injectio...

Embodiment 2

[0030] As an embodiment of the present invention, the fluorescent cover frame 12 is composed of a fluorescent cover plate 15 having a plurality of cup-shaped bodies 13 and a fluorescent glue 14 arranged in the cup-shaped bodies 13, as image 3 shown. The fluorescent cover 15 is formed with a plurality of cups 13 , which are in the shape of a circular frustum, an ellipse or a truncated prism, and have a constricted end and an upward facing open end. The LED chip 11 of the die bonding wire on the substrate 10 is located in the cup 13 , and each cup 13 is provided with one or more LED chips 11 . The light emitted by the LED chip 11 is mixed with the light emitted by the excited phosphor to generate light of desired color.

[0031] The cup 13 is filled with fluorescent glue 14 covering the LED chip 11 . Phosphor powder matched with the LED chip 11 is evenly distributed in the fluorescent glue 14, so that the LED module emits the color of the required color gamut, for example, th...

Embodiment 3

[0034] As another embodiment of the present invention, the fluorescent cover frame 12 is composed of a fluorescent cover plate 15 having a plurality of cup-shaped bodies 13 and a phosphor layer 16 arranged at the mouth of the cup-shaped bodies 13, as Figure 4 shown. The fluorescent cover 15 is formed with a plurality of cups 13 , which are in the shape of a circular frustum, an ellipse or a truncated prism, and have a constricted end and an upward facing open end. The LED chip 11 of the die bonding wire on the substrate 10 is located in the cup 13 , and each cup 13 is provided with one or more LED chips 11 . The light emitted by the LED chip 11 is mixed with the light emitted by the phosphor powder to generate the desired color light.

[0035] The cup 13 is filled with silica gel 17 covering the LED chip 11 . A phosphor layer 16 matching the LED chip 11 is provided on the upper surface of the silica gel 17, so that the LED module emits light of the desired color gamut, such...

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Abstract

The invention provides an LED module and an LED illumination device which are suitable for the illumination field. The LED module comprises a substrate and a plurality of LED chips fixed on the substrate by die bond wire bonding wires; and the upper surface of the substrate is provided with a fluorescent cover frame covering the LED chips. In the invention, the fluorescent cover frame covers the LED chips to make the LED module become a surface light source with even luminance distribution; light emitted from the LED chips and light emitted from stimulated fluorescent powder thereof are mixedto generate light of a required color; the light of the required color emerges from the fluorescent cover frame and is soft, and glare is eliminated. The LED module and the LED illumination device are especially suitable for indoor illumination.

Description

technical field [0001] The invention belongs to the lighting field, and in particular relates to an LED module and an LED lighting device. Background technique [0002] As we all know, LED, as a new generation of green lighting source, has many advantages such as high luminous efficiency, long life, bright colors, energy saving, and environmental protection. plant growth etc. [0003] In the existing LED module, the light emitted by each LED chip forms a point light source. The entire LED module is a collection of multiple point light sources. The illumination is not uniform and soft enough, and the glare is serious, which fails to meet the high lighting requirements. Contents of the invention [0004] The purpose of the embodiments of the present invention is to provide an LED module, aiming at solving the problems of insufficient uniform illumination and serious glare in the existing LED modules. [0005] The embodiment of the present invention is achieved in this ...

Claims

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Application Information

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Patent Type & Authority Patents(China)
IPC IPC(8): H01L33/48H01L33/50H01L33/00F21S2/00F21Y101/02
Inventor 刘鑫
Owner SHENZHEN REFOND OPTOELECTRONICS