Grinding head adjusting mechanism of wafer back grinding machine

Abstract

The invention provides a grinding head adjusting mechanism of a wafer back grinding machine, which is used for adjusting the front inclined angle, the rear inclined angle, the left inclined angle and the right inclined angle of the grinding head. The adjusting mechanism at least comprises a first support plate, a second support plate and a grinding head seat, wherein the second support plate is movably connected with the first support plate; the grinding head seat is movably connected with the second support plate. The grinding head adjusting mechanism is mainly characterized in that a cambered surface of a longitudinal arc butts against an inclined plane of a vertical inclined block, so that the inclined plane of the vertical inclined block vertically moves to force the longitudinal round shaft to transversely move and further drive the grinding head seat to incline forwards or backward around the axial center; by using the combination of a first screw hole plate and a second screw hole plate with a longitudinal adjusting piece and the thread pitch difference of threads, the accurate adjustment on the left inclined angle and the right inclined angle can be realized. Compared withthe prior art, the invention is not only convenient to adjust the operation, but also can achieve the accurate adjustment of a two-dimensional space, thereby overcoming the defects of inconvenient adjustment and operation, time consuming and labor consuming so as to reduce the work efficiency and the like in the prior art.

Description

technical field [0001] The invention relates to a technical adjustment technology, in particular to a grinding head adjustment mechanism applied to a wafer back grinder. Background technique [0002] With the rapid development of the electronic information industry, the use of integrated circuits (ICs) has become ubiquitous. Therefore, as raw materials for integrated circuits, the development of wafer manufacturing and processing industries is also developing day by day. As an extremely precise device, integrated circuits cannot be ignored in all production processes. Every step in the wafer manufacturing process, including etching, oxidation, deposition, photoresist removal, and chemical mechanical grinding, etc., has extremely strict requirements and restrictions on the grinding accuracy of the wafer during the mechanical grinding process. [0003] In order to thin the semiconductor package, the backside of the wafer is usually ground, and this process is completed by a w...

AI Technical Summary

Problems solved by technology

[0004] In the prior art, both the horizontal adjustment and the longitudinal adjustment of the grinding head of the back grinder adopt the method of screwing in and out of the screw hole, because most of the grinding heads of the back grinder are equipped with quality comparison A heavy driving device (such as a motor), so it needs a lot of power to adjust its displacement, so the adjustment screw used is also a high-strength adjustment screw with a long tooth diameter and a wide pitch. However, since the grinding head is mostly For microscopic inclination, if the above-mentioned adjusting screw is slightly screwed in or out, a large error will be formed, which will lead to inaccurate adjustment. Set the adjusting screw, and when adjusting the grinding head, use the method of screwing out and screwing in at the same time to achieve the purpose of precise adjustment. However, the adjustment screw is located on both sides of the grinding head. , thereby reducing work efficiency

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