Manufacturing process for high-frequency multilayer mixed compression signal plate
A manufacturing process and signal board technology, which is applied in multi-layer circuit manufacturing, printed circuit manufacturing, electrical components, etc., can solve the problems of large assembly volume of high-frequency boards, achieve production quality and mass production conditions, save energy, reduce The effect of production costs
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[0028] The present invention is described in further detail below with preferred embodiment:
[0029] The present invention changes the lamination process and copper sinking pretreatment process on the basis of the traditional production process, thereby ensuring production quality and mass production conditions.
[0030] A: Changes in the lamination process:
[0031] I: Typesetting (completed by two high-frequency board core boards + 1 ordinary PP sheet) requires high-frequency board core boards to be etched and pressed within 8 hours. According to the characteristics of high-frequency boards, the surface activity is after 8 hours. It will gradually disappear, so the longest residence time from etching to pressing is controlled within 8 hours. To ensure the reliability of pressing.
[0032] II: Lamination (according to the production capacity of the press, the typesetting production boards are superimposed into a certain number of layers). The number of kraft papers is 10 o...
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