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Manufacturing process for high-frequency multilayer mixed compression signal plate

A manufacturing process and signal board technology, which is applied in multi-layer circuit manufacturing, printed circuit manufacturing, electrical components, etc., can solve the problems of large assembly volume of high-frequency boards, achieve production quality and mass production conditions, save energy, reduce The effect of production costs

Inactive Publication Date: 2010-12-08
统赢软性电路(珠海)有限公司
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

[0017] The purpose of the present invention is to provide a manufacturing process for a high-frequency multi-layer mixed-voltage signal board, which reduces procedures, improves quality, improves efficiency, saves energy, and reduces production costs. The conventional high-frequency board can be changed from double-sided to 4-sided according to customers. According to the requirements of multi-layer design, through the change of part of the production process, the mass production of high-frequency multi-layer mixed-voltage signal boards has been realized, and the double-sided boards have been changed into four-layer boards, thus solving the problem of excessive assembly volume of existing high-frequency boards

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  • Manufacturing process for high-frequency multilayer mixed compression signal plate
  • Manufacturing process for high-frequency multilayer mixed compression signal plate
  • Manufacturing process for high-frequency multilayer mixed compression signal plate

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Embodiment Construction

[0028] The present invention is described in further detail below with preferred embodiment:

[0029] The present invention changes the lamination process and copper sinking pretreatment process on the basis of the traditional production process, thereby ensuring production quality and mass production conditions.

[0030] A: Changes in the lamination process:

[0031] I: Typesetting (completed by two high-frequency board core boards + 1 ordinary PP sheet) requires high-frequency board core boards to be etched and pressed within 8 hours. According to the characteristics of high-frequency boards, the surface activity is after 8 hours. It will gradually disappear, so the longest residence time from etching to pressing is controlled within 8 hours. To ensure the reliability of pressing.

[0032] II: Lamination (according to the production capacity of the press, the typesetting production boards are superimposed into a certain number of layers). The number of kraft papers is 10 o...

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Abstract

The invention relates to a manufacturing process for a high-frequency multilayer mixed compression signal plate. The existing multilayer mixed compression signal plate manufacturing process has complicated procedure, high production cost, low efficiency and energy wastage. The invention changes the compression process and the plated through hole (PTH) pretreatment process, wherein the compression process is changed as follows: typesetting is finished by two high-frequency plates and a common PP film and requires that the high-frequency plates finish compression after finishing etching; lamination is characterized in that typeset production plates are laminated into certain layers according to the production capacity of a press, and kraft paper comprises 10 pieces of old kraft paper and 10 pieces of new kraft paper; and compression is characterized by completing the finished structure of the product under high temperature and high pressure. The PTH pretreatment process is changed as follows: changing the polarity of teflon resin, inflating for 8min, desmearing for 15min, neutralizing for 5min, grinding the plates once, soaking in sodium naphthaline stock solution for 20min, and putting into a cylinder after carrying out secondary neutralizing. The invention realizes the mixed compression process of the high-frequency plate and the common PP, realizes the mass production of the mixed compression plate and reduces the production cost.

Description

technical field [0001] The invention relates to the field of electronic circuit production, in particular to a manufacturing process of a high-frequency multi-layer mixed-voltage signal board. Background technique [0002] The existing manufacturing process of multi-layer mixed voltage signal board includes common four-layer signal board lamination and manufacturing process, ordinary four-layer board copper sinking pre-treatment manufacturing process and high-frequency board copper sinking pre-treatment manufacturing process. [0003] Ordinary four-layer signal board lamination and manufacturing process are: [0004] I: typesetting (completed by an inner core board, two films and two copper foils) [0005] There is basically no requirement for the placement time of ordinary core boards after etching. [0006] II: Lamination (according to the production capacity of the press, the typesetting production boards are superimposed into a certain number of layers) [0007] The n...

Claims

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Application Information

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IPC IPC(8): H05K3/46H05K3/00
Inventor 阙民辉
Owner 统赢软性电路(珠海)有限公司