Method for bonding crystal bar splicing seams

Abstract

The invention discloses a method for bonding crystal bar splicing seams, which belongs to the technical field of crystal rod bonding. The invention aims to solve the problem of providing the method, which can effectively reduce the disconnection rate, for bonding the crystal bar splicing seams. An adopted technical scheme is that the method is implemented according to the following sequence: a, preparing bars, namely arranged at least two shorter crystal bars in pairs to satisfy the length required by slicing machine processing; b, preprocessing selected crystal bars to ensure that the end face verticality of the crystal bars is less than or equal to 1.5 mm, and the end faces are clean without impurities; c, bonding the crystal bars, namely applying glue water to the end face of one of the crystal bars and butting the two crystal bars; d, processing the crystal bars after bonding, namely cleaning residual glue on the surfaces of the crystal bars, and standing the well-bonded crystal bars for 20 minutes; and e, repeating the third step and the fourth step to bond all the crystal bars arranged in pairs. The method can effectively reduce the disconnection rate and the rejection rate of the crystal bars, and improve the rate of finished products to a great extent, so the production cost is reduced, and the method can be popularized and applied to the crystal bar bonding before crystal bar slicing.

Description

technical field [0001] The invention relates to a splicing seam bonding method of crystal rods, which belongs to the technical field of crystal rod bonding. Background technique [0002] At present, due to the different lengths of the single crystals pulled out by crystal pulling in the industry, the length of the ingot after cutting in the subsequent section cannot meet the processing requirements of the slicer (300mm / piece). In order to improve the processing efficiency of the slicer, the industry Match two shorter crystal rods together to reach a length of 300mm. In order not to pinch the steel wire, the traditional method is to leave a gap of 2-3mm between the two short rods when gluing, but due to The inclined surface generated during cutting is extremely easy to cause fragments to fall when slicing, and sometimes it will be brought to the wire net to cause jumper wires, and in serious cases, wire breakage will occur. It will cause scrapping, even if the broken wire is...

AI Technical Summary

Problems solved by technology

[0002] At present, due to the different lengths of the single crystals pulled out by crystal pulling in the industry, the length of the ingot after cutting in the subsequent section cannot meet the processing requirements of the slicer (300mm / piece). In order to improve the processing efficiency of the slicer, the industry Match two shorter crystal rods together to reach a length of 300mm. In order not to pinch the steel wire, the traditional method is to leave a gap of 2-3mm between the two short rods when gluing, but due to The inclined surface generated during cutting is extremely easy to cause fragments to fall when slicing, and sometimes it will be brought to the wire net to cause jumper wires, and in serious cases, wire breakage will occur. It will cause scrapping, even if the broken wire is connected, there will be one or even a few line marks or defective products such as color difference film on the surface of the general silicon wafer, which greatly reduces the yield of the product