Method for forecasting working life of integrated circuit based on electronic speckle technique

Abstract

The invention discloses a method for forecasting the working life of an integrated circuit based on an electronic speckle technique, and the method comprises the following steps: applying temperature stress to an integrated circuit test piece by establishing a measuring system based on the electronic speckle technique, measuring change rules of out-of-plane displacement of the integrated circuit test piece encapsulation along with temperature, finding a temperature point where a failure mechanism of the integrated circuit test piece changes, and then determining a temperature range consistent with the failure mechanism; then exacting failure activation energy according to the change rules of the out-of-plane displacement of the integrated circuit test piece in the temperature range consistent with the failure mechanism; and finally, establishing a life forecasting model in combination with an Arrhenius model and an accumulative failure model and obtaining the working life of the integrated circuit test piece in different temperature environments.

Description

technical field [0001] The invention relates to the field of reliability analysis and life prediction of integrated circuit test pieces, in particular to a method for predicting the working life of integrated circuits based on electronic speckle technology. Background technique [0002] With the development of electronic technology, the volume of microelectronic devices is continuously reduced, and the degree of integration is increasing. With the multi-functionalization and complexity of integrated circuits, reliability analysis is becoming more and more difficult, and there are more and more new varieties. , the reliability test technology is becoming more and more difficult, and various test detection devices, test detection technologies, and test evaluation methods are also constantly developing. In addition, the continuous emergence of new materials, new processes, and new use environments make new problems appear after the old failure problems are solved, which makes f...

AI Technical Summary

Problems solved by technology

However, the above research only stays in the analysis of the thermal deformation and thermal stress of the package, without in-depth research on its reliability life, and lacks a perfect system integrating detection and reliability life prediction.

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