Method for forecasting working life of integrated circuit based on electronic speckle technique

An integrated circuit and electronic speckle technology, which is applied in the field of predicting the working life of integrated circuits based on electronic speckle technology, can solve the problems of no reliability life research and lack, etc., and achieve the goal of overcoming long environmental test times, overcoming errors, and high precision Effect

Inactive Publication Date: 2010-12-15
GUILIN UNIV OF ELECTRONIC TECH
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  • Abstract
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Problems solved by technology

However, the above research only stays in the analysis of the thermal deformation and thermal stress of the package, without in-depth research on its reliability life, and lacks a perfect system integrating detection and reliability life prediction.

Method used

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  • Method for forecasting working life of integrated circuit based on electronic speckle technique
  • Method for forecasting working life of integrated circuit based on electronic speckle technique
  • Method for forecasting working life of integrated circuit based on electronic speckle technique

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Embodiment Construction

[0030] The present invention provides a method for predicting the working life of integrated circuits based on electronic speckle technology, such as figure 1 shown, including the following steps:

[0031] 1) Establish a set of optical test platform based on electronic speckle technology, and place the integrated circuit test piece on the built optical test platform, use the temperature control system to apply sequential temperature stress to the integrated circuit test piece, and at the same time give the test piece A normal level of constant electrical stress is applied.

[0032] In the experiment, the out-of-plane displacement of the integrated circuit package was measured under the condition of thermal stress. The principle is as follows: figure 2shown. In the preferred embodiment of the present invention, the optical test platform is mainly composed of a laser, a beam splitter, 2 mirrors, 2 beam expanders, an imaging lens, a beam combining prism, an electrical coupling...

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Abstract

The invention discloses a method for forecasting the working life of an integrated circuit based on an electronic speckle technique, and the method comprises the following steps: applying temperature stress to an integrated circuit test piece by establishing a measuring system based on the electronic speckle technique, measuring change rules of out-of-plane displacement of the integrated circuit test piece encapsulation along with temperature, finding a temperature point where a failure mechanism of the integrated circuit test piece changes, and then determining a temperature range consistent with the failure mechanism; then exacting failure activation energy according to the change rules of the out-of-plane displacement of the integrated circuit test piece in the temperature range consistent with the failure mechanism; and finally, establishing a life forecasting model in combination with an Arrhenius model and an accumulative failure model and obtaining the working life of the integrated circuit test piece in different temperature environments.

Description

technical field [0001] The invention relates to the field of reliability analysis and life prediction of integrated circuit test pieces, in particular to a method for predicting the working life of integrated circuits based on electronic speckle technology. Background technique [0002] With the development of electronic technology, the volume of microelectronic devices is continuously reduced, and the degree of integration is increasing. With the multi-functionalization and complexity of integrated circuits, reliability analysis is becoming more and more difficult, and there are more and more new varieties. , the reliability test technology is becoming more and more difficult, and various test detection devices, test detection technologies, and test evaluation methods are also constantly developing. In addition, the continuous emergence of new materials, new processes, and new use environments make new problems appear after the old failure problems are solved, which makes f...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): G01R31/303
Inventor 袁纵横宋美杰熊显名张文涛
Owner GUILIN UNIV OF ELECTRONIC TECH
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