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58 results about "Out of plane displacement" patented technology

Device and method of perspective measurement of distribution of out-of-plane displacement field in resin matrix composite

The invention discloses a device and a method of perspective measurement of distribution of an out-of-plane displacement field in a resin matrix composite. The device is an optical system designed with Michelson multi-surface interference, and a double-surface optical wedge is introduced into a reference arm end, so that an interference image between the optical wedge and a reflected signal in the measured resin matrix composite is formed. The optical wedge has two effects, and is firstly used for monitoring a laser wave number k and is secondly used for providing an interferential reference plane. Through temperature scan, the wave number of output laser of a semiconductor laser controller is scanned, and meanwhile, multiple frames of interference images are shot by a CCD (Charged Coupled Device) camera. Fourier transform is respectively carried out on interference image sequences before and after loading, the distribution of the out-of-plane displacement field in the measured resin matrix composite component can be demodulated through a phase difference corresponding to an interference peak value. The device and the method have the advantages that the perspective measurement can be realized, and the measuring precision of the out-of-plane displacement field is high, so that a novel technology platform for the mechanical property measurement and the nondestructive testing in the resin matrix composite is provided.
Owner:GUANGDONG UNIV OF TECH

Multifunctional intelligent type laser speckle interference measuring device and method

The invention discloses a multifunctional intelligent type laser speckle interference measuring device and a measuring method. Measurement of out-of-plane displacement of materials such as magnetic conduction and electric conduction materials under different temperature and pressure is achieved through combination of an optical alignment system, a beam splitter, a reflecting mirror, a material testing system, a charge coupled device (CCD) imaging system, temperature sensing technology and single chip technology. The optical alignment system has functions of alignment and spherical aberration elimination, and can ensure high-quality interference imaging. Out-of-plane displacement measuring tests of cylindrical samples, cube-shaped samples, cuboid samples and the like with different materials, shapes and sizes can be achieved by a material frame, and thus application range is wide. Strength of pressing can be judged by quantizing a rotation angle. Temperature of a tested object is improved by an electrical eddy current heating system so as to enable test researches to be free from influence of objective temperature environment. Accuracy of temperature measurement is improved by a temperature sensor and a single chip so that a temperature control system is intelligent. The measuring device has the advantages of being compact in structure, convenient to use, flexible, high in imaging quality, intelligent and the like, and is suitable for being widely used in the fields of machinery, construction, water conservancy, electrical equipment, aerospace, weapon industry, biomedicine and the like.
Owner:SHENYANG NORMAL UNIV

Electronic speckle pattern interference detection system and lossless detection method for failures of solder balls

The invention belongs to the field of electronic packaging and relates to an electronic speckle pattern interference detection system and method for failures of solder balls in board assembly ball grid array packaging devices. The system provided by the invention comprises a detection sample fixing and loading part, an electronic speckle pattern interference out-of-plane displacement testing light path part and a computer data analyzing and processing part, wherein the electronic speckle pattern interference out-of-plane displacement testing light path part is used for forming the interference fringes of the detection sample after deforming under a mechanical load, namely out-of-plane micro-displacement information; the computer data analyzing and processing part is used for collecting the fringes, carrying out phase unpacking and displacement computation and positioning failure regions; and the out-of-plane displacement fringes of a standard sample and the sample are compared to determine whether the sample is subjected to the failure of the solder balls or not. The system provided by the invention has the advantages of simple composition components, no damage on the devices in a measuring course, simple and convenient detection method, good process integrity and real-time measurement realization on a production line, thereby greatly enhancing the detection efficiency of the failure of the solder balls in the board assembly ball grid array packaging devices.
Owner:FUDAN UNIV

Elastic forming method for panel of curtain wall and curved-surface building curtain wall

The invention discloses an elastic forming method for a panel of a curtain wall and a curved-surface building curtain wall constructed by the same. The curved-surface building curtain wall at least comprises two parts in four parts, namely a panel, a framework, nipping points and a support; the panel is provided with the nipping points by utilizing the elasticity of a material through the elastic forming method; and the support of the nipping points applies the out-of-plane displacement on the panel, so that the panel generates elastic deformation to form and maintain the curved surface of a building. The invention can be also applied in the fields such as building roofing or ceiling and the like. The prior construction methods for the curved-surface building curtain wall are mainly a casting forming method, a plastic forming method and a plane fitting method; the plastic forming method is to preprocess the curved surface on the panel by casting and plastic methods and arrange the panel onto the framework and the support, but has high cost; and the plane fitting method has low cost but has not ideal construction effect. Adjacent plates of the curved-surface building curtain wall have natural transition, the whole appearance of the building is more smooth and beautiful, and the building has better appearance and the cost is lower than the curved-surface building curtain wall constructed by the casting forming method, the plastic forming method and the plane fitting method. The elastic forming method achieves perfect integration of the building appearance and construction cost.
Owner:SHANGHAI JANGHO CURTAIN WALL SYST ENG +2

Wide view field type infrared light three-dimensional morphology measurement method and device thereof

The invention relates to a large-scale infrared light three-dimensional morphology measurement method. The method comprises the following steps: 1) a 0.5 line/mm type grating is projected onto an object to be measured by an infrared projector; 2) projected images are acquired from three angles, calibrated images of projection apparatuses projected onto a reference plane at different view angles are recorded successively, and then measured images of each projection apparatus projected onto the surface of the object to be measured at the measurement time are recorded successively; 3) the partitioning algorithm is used in the calibrated images and the measured images to partition projection lines, and the centerline recognition algorithm is used to determine the centerline position of the projection lines; 4) the triangulation theory is used to obtain height difference data of corresponding points between the calibrated images and the measured images, that is the out-of-plane displacement curve of each projection line; 5) the rotation translation matrix between two adjacent shooting angles is calculated through the curve Euclidean distance and quaternion; 6) and the height difference data of each projection apparatus is merged into the final three-dimensional morphology data to obtain the three-dimensional morphology measurement result; in the projected image acquisition process, the projected images are acquired from three angles; wherein the constraint condition is that part of information between two adjacent acquisition angles is coincident for calculating the rotation translation matrix in the step 5).
Owner:PEKING UNIV

Three-dimensional deformation measuring method based on synthesis wavelength double-light-source shearing speckle interferometry

InactiveCN108007375ASimple optical path designHigh precisionUsing optical meansElectricityPhase shifted
The invention provides a three-dimensional deformation measuring method based on synthesis wavelength double-light-source shearing speckle interferometry, and belongs to the technical field of opticalimaging. The method includes: red laser and green laser respectively pass through a light beam splitter and are irradiated to a measured object through a reflecting mirror and a light beam expander,reflection occurs on the surface of the measured object, the reflected light passes through a convex lens and performs light interference through a shearing mirror, and an interference image is acquired in a CCD camera; a PZT phase shift amount is controlled through a piezoelectric ceramic controller, and the red laser and the green laser are respectively and simultaneously recorded through the CCD camera through an R channel and a G channel of a color camera; the pressure in a vacuum box is adjusted through a pressure adjusting valve, and a pressure value is displayed through a pressure meter; Fourier transform is performed on the interference image, and the relation between the synthesis wavelength phase fringe number and the single wavelength fringe number is calculated; and an in-planedisplacement derivative matrix and an out-of-plane displacement derivative matrix are calculated, and a three-dimensional deformation matrix of the object is obtained according to optical geometric characteristics of a measuring system to realize three-dimensional deformation measurement of the object.
Owner:QIQIHAR UNIVERSITY

Two-dimensional displacement measurement device and method

The present invention relates to a two-dimensional displacement measurement device. The device comprises a laser configured to output polarization laser; a light splitting frequency shift module configured to perform light splitting of the polarization laser and realize differential frequency shift to form at least three beams of light, wherein the frequencies of the three beams of light are different; a gathering module configured to gather the at least three beams of light, allow the at least three beams of light to enter a target to be measured and receive laser returned back through scattering by the target to be measured to allow the returned laser to enter a laser to modulate the light intensity of the laser outputted by the laser; a signal detection module arranged on the optical path of the polarization laser being emergent from the laser and configured to perform detection of the light intensity of the laser outputted by the laser and convert the light intensity of the laser as electric signals; and a signal processing module connected with the signal detection module and configured to process and calculate the electric signals outputted by the signal output module and obtain out-of-plane displacement and in-plane displacement. The present invention further provides a displacement measurement method. The two-dimensional displacement measurement device and method are high in measurement precision.
Owner:TSINGHUA UNIV

Process for manufacturing three-layer continuous surface type MEMS deformable mirror based on bonding process

InactiveCN101604069ASolve the disadvantages of difficult processingEliminates the effects of static pull-inOptical elementsBonding processOut of plane displacement
The invention discloses a process for manufacturing a three-layer continuous surface type MEMS deformable mirror based on a bonding process, which mainly comprises the following steps: performing dry-etching of a releasing hole on the upper surface of an SOI wafer, partially releasing a middle oxidation layer of the SOI wafer, performing wet-etching on the lower surface of the SOI wafer, depositing a metal on another substrate (silicon wafer or glass) as an electrode structure, and finally bonding the substrate and the SOI wafer. The process is characterized in that a bulk silicon micromachining process and a surface micromachining process are combined, and an upper two-layer structure obtained by adopting the bulk silicon process and a lower electrode structural layer obtained by adopting surface micromachining are bonded to form a three-layer micromechanical structure. The process for manufacturing the three-layer continuous surface type MEMS deformable mirror based on the bonding process has a relatively easy manufacturing process, overcomes the defect that the prior continuous surface micromechanical deformable mirror is difficult to process through three-layer surface micromachining, can eliminate the defect of short circuit due to electrostatic draw-in by adding a silicon nitride insulating layer, and can be widely applicable in the fields of optical communication and adaptive optics; and the machined deformable mirror can obtain large out-of-plane displacement.
Owner:INST OF OPTICS & ELECTRONICS - CHINESE ACAD OF SCI

Three-dimensional displacement measurement system and method based on laser self-mixing grating interference

The invention discloses a three-dimensional displacement measurement system and method based on laser self-mixing grating interference, and the system comprises a semiconductor laser sensor head, a plane reflector, a reflective two-dimensional plane grating, a data acquisition card and a computer, wherein the laser emitted from the semiconductor laser sensor head is incident on the reflective two-dimensional grating, the corresponding diffracted light is fed back to the semiconductor laser sensor head along the original optical path to generate self-mixing interference, the self-mixing interference signal is converted into an electrical signal by the photodetector built in the semiconductor laser and is output to the data acquisition card to obtain three-dimensional displacement of the target to be measured after computer processing. The invention solves the problem that the range of a traditional grating interferometer is limited when performing out-of-plane displacement measurement,is more compact than the traditional grating interferometer, maintains the advantages of self-collimation of the laser self-mixing interferometer, and can realize three-dimensional real-time displacement measurement system and method with a simple structure, wide rang and high resolution.
Owner:NANJING NORMAL UNIVERSITY

Vertical compression test device suitable for bending large panels

The invention discloses a vertical compression test device suitable for bending large panels, belonging to the field of structural test mechanics. Fixed baffle plates are arranged on a base; sliding rails are welded to the inner sides of the fixed baffle plates; sliding bearings are installed on the sliding rails on two sides; a test piece is vertically arranged above the base and located betweenthe fixed baffle plates; the test piece, namely the panel is clamped by the sliding bearings; a loading chuck is arrange above the test piece; and the front and rear sides of the test piece are provided with detachable protective baffle plates. The vertical compression test device adopts a sliding bearing supporting mode, the friction force is reduced and the stress at the structural transition isbalanced, the out-of-plane displacement of the test piece is limited, so that that the out-of-plane load at the joint is prevent from causing material failure ahead of time, the compression load testof the bent large panel can be realized simply and efficiently, the structure is simple and reliable, the precision is high, the maintenance is simple and convenient, the compression test of the bentlarge panel can be realized on an ordinary press, and the vertical compression test device is suitable for use in various environments.
Owner:NANJING UNIV OF AERONAUTICS & ASTRONAUTICS +1
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