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Configurable radio-frequency power amplifier and radio-frequency transmitting front-end module with same

A technology of radio frequency power and front-end modules, applied in power amplifiers, sustainable buildings, climate sustainability, etc., can solve the problems of high cost, low integration, and large area of ​​mobile terminals, and achieve the reduction of circuit board area and reduction Quantity, the effect of reducing manufacturing cost

Active Publication Date: 2010-12-15
SPREADTRUM COMM (SHANGHAI) CO LTD
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

[0005] In order to overcome the defects of large area and low integration level of the existing multi-power mode radio frequency transmission front-end module and the high cost of the mobile terminal, the present invention provides a configurable radio frequency power amplifier and a radio frequency transmission front-end module containing the amplifier

Method used

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  • Configurable radio-frequency power amplifier and radio-frequency transmitting front-end module with same
  • Configurable radio-frequency power amplifier and radio-frequency transmitting front-end module with same
  • Configurable radio-frequency power amplifier and radio-frequency transmitting front-end module with same

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Embodiment 1

[0036] Such as figure 2 Shown is the implementation of the radio frequency power amplifier with configurable output impedance matching network proposed by the present invention. The radio frequency power amplifier includes a radio frequency power amplifier die 201, a first inductor L1, a second inductor L2, a third inductor L3, a first capacitor C1, a second capacitor C2, a third capacitor C3, a radio frequency switch 112, a radio frequency switch 113 and an antenna 115. The input of the RF power amplifier is connected to the RF input signal (RF IN ), the output end is connected to one end of the first inductance L1 and the second inductance L2; the other end of the first inductance L1 is connected to one end of the third inductance L3 and one end of the third capacitor C3; the other end of the third inductance L3 is connected to The DC power supply terminal V of the RF power amplifier CC The other end of the third capacitor C3 is connected to the antenna 115 through the r...

Embodiment 2

[0043] The structure of the first multi-power mode radio frequency transmitting front-end module proposed by the present invention is as follows: image 3 shown. The entire radio frequency transmitting front end is integrated into a single module, which includes a first chip 203 and a second chip 204 . The first chip 203 integrates a high power mode radio frequency power amplifier die 101 and its output matching network 102 and a configurable radio frequency power amplifier 200 with a configurable output impedance matching network 202, the configurable radio frequency power amplifier 200 includes a configurable output impedance The matching network 202 and the configurable radio frequency power amplifier die 201, the bias voltage of the configurable radio frequency power amplifier die 201 can be changed; the first chip 203 is usually manufactured by GaAs HBT process. The power mode controller 110 and the radio frequency switch 111 are integrated on the second chip 204 . The ...

Embodiment 3

[0046] The structure of the second multi-power mode radio frequency transmitting front-end module proposed by the present invention is as follows: Figure 4 shown. The entire radio frequency transmitting front end is integrated into a single module, which includes a third chip 205 and a fourth chip 206 . The high power mode radio frequency power amplifier die 101 and the configurable radio frequency power amplifier die 201 are integrated on the third chip 205; the third chip 205 is generally manufactured by GaAs HBT process. The fourth chip 206 integrates a power mode controller 110 , a radio frequency switch 111 , an output matching network 102 of a high power mode radio frequency power amplifier, and a configurable output impedance matching network 202 of a configurable radio frequency power amplifier 200 . The fourth chip is fabricated using a silicon-on-insulator (SOI) process. Because SOI is compatible with the traditional CMOS process on the one hand, it can be conveni...

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Abstract

The invention relates to a configurable radio-frequency power amplifier and a radio-frequency transmitting front-end module with the same. The configurable radio-frequency power amplifier comprises a configurable radio-frequency power amplifier tube core (201) and a configurable output impedance matching network (202); the output end of the configurable radio-frequency power amplifier tube core (201) is connected with the configurable output impedance matching network (202); the configurable output impedance matching network (202) is provided with a plurality of impedance circuits comprising inductors and capacitors; and the configurable output impedance matching network also comprises a radio-frequency switch which controls switch-on or switch-off of each impedance circuit. The configurable radio-frequency power amplifier reduces the number of independent units of a multi-power mode radio-frequency front end and integrates two chips in a single module so that the area, occupied by the multi-power mode radio-frequency transmitting front-end module, of a circuit board of a mobile terminal is reduced, and meanwhile, the manufacturing cost of the mobile terminal is reduced.

Description

technical field [0001] The invention relates to the radio frequency field of mobile terminals, in particular to a configurable radio frequency power amplifier and a radio frequency transmitting front-end module including the amplifier. Background technique [0002] In modern wireless communication systems, the radio frequency transmission front-end module is a key component to realize the wireless transmission of radio frequency signals. As the current wireless communication frequency band becomes more and more crowded, various modulation methods with high frequency band utilization, such as CDMA, WCDMA, and TD-SCDMA, are more and more widely used. These modulation methods all require that the radio frequency power amplifier in the radio frequency transmitting front end of the mobile terminal has high linearity to ensure high quality of voice call and data communication. However, the improvement of linearity is at the expense of the reduction of the average efficiency of th...

Claims

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Application Information

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IPC IPC(8): H03F3/20
CPCY02B60/50
Inventor 赵冬末袁志鹏
Owner SPREADTRUM COMM (SHANGHAI) CO LTD
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