Manufacturing method of thin base plate for packaging semiconductor
A technology of thin substrates and manufacturing methods, applied in semiconductor/solid-state device manufacturing, semiconductor devices, semiconductor/solid-state device components, etc., can solve problems such as difficulty in ensuring damage to thin substrates, warpage of plates, and excessive warpage
Active Publication Date: 2010-12-29
ASE SHANGHAI
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Problems solved by technology
However, due to the thickness of the board being too thin, coupled with the limitation of the horizontal ability of the machine when transporting the board, thin boards often encounter problems such as board warpage, board cracking, and board getting caught in the machine roller.
Therefore, if only the thin substrates are produced according to the traditional method of manufacturing thick plates, it will inevitably cause a huge loss in the yield of the thin substrates and the degree of warpage will exceed the predetermined standard.
At the same time, it is difficult to ensure that the thin substrate will not be damaged by shaking or external force collision during manual handling.
According to statistics, the yield loss of thin substrates due to the above shortcomings can reach about 30%.
Method used
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[0027] In order to make the above-mentioned purposes, features and advantages of the present invention more obvious and understandable, the preferred embodiments of the present invention will be specifically cited below, together with the accompanying drawings, for a detailed description as follows:
[0028] Please refer to Figures 1A to 1D As shown, the manufacturing method of the thin substrate for semiconductor packaging according to the first embodiment of the present invention mainly includes the following steps: providing a thin substrate 1 whose thickness is not more than 0.2 millimeters (mm), and the surrounding of the thin substrate 1 has an invalid Edge area A, the invalid edge area A surrounds at least one effective block B; form a photoresist layer (photoresist layer) 2 to cover on the effective block B, and expose a metal surface of the invalid edge area A; electroplating forming a thickened strengthening frame strip 3 on the metal surface of the invalid edge are...
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Abstract
The invention discloses a manufacturing method of a thin base plate for packaging a semiconductor, comprising the following steps of: firstly providing a thin base plate with the thickness not greater than 0.2 millimeter, wherein an invalid border area is arranged around the thin base plate and surrounds at least one valid block; then forming a thickened strengthening frame strip on the invalid border area by adopting an electroplating or etching process together with a photoresist; and removing a photoresist layer to obtain the thin base plate with the strengthening frame strip, thereby improving the bending resistance of the thin base plate.
Description
【Technical field】 [0001] The invention relates to a method for manufacturing a thin substrate for semiconductor packaging, in particular to a method for manufacturing a thin substrate for semiconductor packaging that can improve bending resistance. 【Background technique】 [0002] Nowadays, in order to meet the needs of various high-density packaging, the semiconductor packaging industry has gradually developed various types of packaging structures, among which the common packaging structures with substrates include ball grid array packaging structures (ball grid array, BGA), A pin grid array (PGA), a land grid array (LGA), or a board on chip (BOC) package. In the above packaging structure, at least one chip is carried on an upper surface of the substrate, and several pads of the chip are electrically connected to the substrate through a wire bonding or bumping manufacturing process. Several solder pads on the upper surface. At the same time, a large number of pads must be ...
Claims
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Login to View More IPC IPC(8): H01L21/48H01L23/13
Inventor 高洪涛罗光淋方仁广任金虎孙骐
Owner ASE SHANGHAI