Process for producing circuit board metallized semi-holes
A metallized half-hole, manufacturing process technology, applied in the direction of electrical connection formation of printing components, can solve problems such as copper burrs in half-hole holes, achieve good results, broad market application prospects, and simplify the production process.
Inactive Publication Date: 2012-07-04
JIANGMEN SUNTAK CIRCUIT TECH
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Problems solved by technology
[0003] The purpose of the present invention is to provide a simple and feasible metallized half-hole manufacturing process for circuit boards, which can effectively solve the problem of copper burrs in the half-hole and solve the defects in the prior art
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Experimental program
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Effect test
Embodiment 1
[0027] Parameter requirements:
[0028] Inner core board: 0.35mm 1 / 1 (without copper) Number of layers: 6L
[0029] Inner line width spacing: Min 4.0 / 4.0mil Outer line width spacing: Min 4.0 / 4.0mil
[0030] Sheet Tg: 170° Outer Copper Foil: H OZ
[0031] Hole copper thickness: Min 18μm Solder mask: green oil
[0032] Surface technology: immersion gold Half hole diameter: 1.20mm
[0033] Finished plate thickness: 1.6mm+ / -10% Working PNL size: 610mm*520mm
[0034] Board making process:
[0035] 1. Cutting - cut out the core board according to the panel size 610mm*520mm, the thickness of the core board is 0.35mm 1 / 1 (excluding copper);
[0036] 2. Inner layer——Complete the exposure of the inner layer circuit with 5-7 grid exposure rulers (21 grid exposure rulers), etch the inner layer circuit pattern after development, and the minimum measurement of the inner layer line width is 3.9mil;
[0037] 3. Inner layer AOI - check the inner layer for open and short circuit defects a...
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The invention discloses a process for producing circuit board metallized semi-holes, which comprises the following steps: A) carrying out board cutting on a circuit board substrate, attaching a sensitive dry film on the surface of the substrate, and carrying out copper plating and tinplating on circuits according to a circuit board positive process; B) completing the exposure of the inner-layer circuits; C) carrying out press-fitting on the obtained board so as to obtain a laminated board; D) carrying out PTH (plated though hole) plating on the whole laminated board, and carrying out outer pattern transfer and pattern plating on the laminated board subjected to PTH plating; E) producing semi-holes; F) carrying out AOI detection on the outer-layer circuits, detecting the defects such as open / short circuits, and the like in the outer layer, and then modifying the defects; G) carrying out welding resistance on the obtained product; H) carrying out immersion nickel / gold on the whole board; and I) testing and checking the electrical properties and appearances of the finished board so as to obtain the finished product. The process of the invention is adjusted from the production flow, without drilling for deburring, thereby not only simplifying the production processes of traditional semi-hole boards, but also completely solving the problem of copper burrs in the semi-holes; the forming effect of the semi-hole is good; and the process of the invention has wide market application prospect.
Description
technical field [0001] The invention belongs to the technical field of circuit board processing, and in particular relates to a manufacturing process of metallized semi-holes on the edge of a circuit board. Background technique [0002] With the continuous development of electronic products, customers have more and more diversified requirements for metallized half-holes on the edge of the board. At the same time, the quality of the metallized half-holes on the edge of the board directly affects the installation and use of customers. How to control the product quality after the semi-metallized hole is formed on the edge of the board: For example, the copper burr on the hole wall is raised and left, which has always been a difficult problem in the machining process. The PCB with a whole row of semi-metallized holes on the side of the board is characterized by relatively small individuals, and is mostly used on the carrier board as a daughter board of a motherboard. Through the...
Claims
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IPC IPC(8): H05K3/42
Inventor 韦昊张庭主
Owner JIANGMEN SUNTAK CIRCUIT TECH