Antireflective film SiNx:H surface in-situ NH3 plasma treatment method
A plasma and treatment method technology, applied in the field of solar cell manufacturing process, can solve the problems of over-plating, poor surface appearance of solar cells, degradation of solar cell performance, etc., so as to be suitable for large-scale production, compatible with production processes, and reduce over-plating problems Effect
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Embodiment 1
[0023] 1.SiN x :H film deposition: first deposit SiN on crystalline silicon solar cells by conventional plasma-enhanced chemical vapor method (PECVD) x :H film, the thickness and refractive index are determined according to the requirements of the emission reduction layer.
[0024] 2.N 2 Plasma bombardment: SiN x : Immediately after H deposition, in situ with N 2 Plasma bombardment of SiN x :H surface for 10 seconds, the purpose is to remove SiN x : Weaker amine bonds, -NH, Si-H bonds, etc. in H films. This one-step process can increase the density of the film and reduce pinholes.
[0025] 3. NH 3 or NH 3 and N 2 Plasma treatment: followed by in situ NH 3 or NH 3 and N 2 Plasma surface treatment for 10 s to make unsaturated Si + bond with NH 3 -N(-NH 2 , -NH, -N) are bonded to form Si-N bonds, resulting in the formation of more Si-N bonds in the film, reducing the excess silicon component in the film. In this process, the bombardment of high-energy plasma also ...
Embodiment 2
[0027] 1.SiN x :H film deposition: first deposit SiN on crystalline silicon solar cells by conventional plasma-enhanced chemical vapor method (PECVD) x :H film, the thickness and refractive index are determined according to the requirements of the emission reduction layer.
[0028] 2.N 2 Plasma bombardment: SiN x : Immediately after H deposition, in situ with N 2 Plasma bombardment of SiN x :H surface for 15 seconds, the purpose is to remove SiN x : Weaker amine bonds, -NH, Si-H bonds, etc. in H films. This one-step process can increase the density of the film and reduce pinholes.
[0029] 3. NH 3 or NH 3 and N 2 Plasma treatment: followed by in situ NH 3 or NH 3 and N 2 Plasma surface treatment for 15 s to make unsaturated Si + bond with NH 3 -N(-NH 2 , -NH, -N) are bonded to form Si-N bonds, resulting in the formation of more Si-N bonds in the film, reducing the excess silicon component in the film. In this process, the bombardment of high-energy plasma also ...
Embodiment 3
[0031] 1.SiN x :H film deposition: first deposit SiN on crystalline silicon solar cells by conventional plasma-enhanced chemical vapor method (PECVD) x :H film, the thickness and refractive index are determined according to the requirements of the emission reduction layer.
[0032] 2.N 2 Plasma bombardment: SiN x : Immediately after H deposition, in situ with N 2 Plasma bombardment of SiN x :H surface for 12 seconds, the purpose is to remove SiN x : Weaker amine bonds, -NH, Si-H bonds, etc. in H films. This one-step process can increase the density of the film and reduce pinholes.
[0033] NH 3 or NH 3 and N 2 Plasma treatment: followed by in situ NH 3 or NH 3 and N 2 Plasma surface treatment for 20 s to make unsaturated Si + bond with NH 3 -N(-NH 2 , -NH, -N) are bonded to form Si-N bonds, resulting in the formation of more Si-N bonds in the film, reducing the excess silicon component in the film. In this process, the bombardment of high-energy plasma also occ...
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