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Loudspeaker of micro-electro-mechanical system and electronic device

A technology of micro-electromechanical systems and electronic devices, which is applied in the field of loudspeakers, can solve the problems of reduced radiation angle, low loudness, and difficulty in forming light and thin planar speakers, and achieves the effect of small size and simple structure

Inactive Publication Date: 2011-01-26
HONG FU JIN PRECISION IND (SHENZHEN) CO LTD +1
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

[0004] However, the working process of the above-mentioned dynamic loudspeaker 100 is the conversion of electric energy-magnetic energy-mechanical energy-acoustic energy, which will cause the defects that the higher the sound frequency, the lower the loudness, and the reduced radiation angle.
Moreover, the structure of the dynamic loudspeaker 100 is relatively complicated, and the volume is relatively large, so it is not easy to form a light and thin planar loudspeaker.

Method used

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  • Loudspeaker of micro-electro-mechanical system and electronic device
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  • Loudspeaker of micro-electro-mechanical system and electronic device

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Embodiment Construction

[0013] The embodiments of the present invention will be further described in detail below in conjunction with the accompanying drawings.

[0014] Please also refer to figure 1 and figure 2 , which is a MEMS speaker 200 provided by an embodiment of the present invention. The MEMS speaker 200 includes a substrate 210 , a plurality of heating units 220 , a plurality of spacers 230 between each heating unit 220 and the substrate 210 , and a signal input device 240 .

[0015] The material of the substrate 210 is generally doped n-type silicon or p-type silicon, and may also be intrinsic silicon. A plurality of acoustic holes 212 are formed on the substrate 210 by an etching method, and these acoustic holes 212 pass through the substrate 210 up and down. The etching method generally uses wet etching (Wet Etching), and can also use dry etching (Dry Etching), such as Inductively Coupled Plasma (ICP) or Reactive Ion Etching (RIE). )Wait. In this embodiment, the acoustic hole 212...

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Abstract

The invention provides a loudspeaker of a micro-electro-mechanical system, which comprises a baseplate, a plurality of spacing bodies, a plurality of heating units and a signal input device, wherein the baseplate is provided with a plurality of acoustic holes by penetration; the plurality of the spacing bodies are arranged on the surface of the baseplate, each spacing body forms a gas medium gap, and each gas medium gap is communicated with the corresponding acoustic hole; the plurality of the heating units are correspondingly arranged on the spacing bodies; and the signal input device is used for transferring current signals to the plurality of the heating units, electrifying the plurality of the heating units for heating, and further heating gas media to emit acoustic waves. The invention further provides an electronic device with the loudspeaker of the micro-electro-mechanical system.

Description

technical field [0001] The invention relates to a loudspeaker, in particular to a microelectromechanical system loudspeaker and an electronic device with the microelectromechanical system loudspeaker. Background technique [0002] Loudspeakers are generally composed of signal input devices and sound-generating components. The electrical signal is input to the sound generating element through the signal input device, and then the sound is emitted. The loudspeaker is an electro-acoustic device that converts electrical signals into sound signals. Specifically, the speaker can convert audio electric power signals within a certain range into audible sounds with less distortion and sufficient sound pressure level. There are many types of speakers. Although they work in different ways, they generally push the surrounding gas medium by generating mechanical vibrations, causing the gas medium to fluctuate so as to realize the conversion of "electricity-force-sound". [0003] see ...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): H04R23/00
Inventor 张仁淙
Owner HONG FU JIN PRECISION IND (SHENZHEN) CO LTD
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