Method and apparatus for removing polymer from a substrate

Abstract

A method and an apparatus for removing polymer from a substrate are provided. In one embodiment, an apparatus utilized to remove polymer from a substrate includes a processing chamber having a chamber wall and a chamber lid defining a process volume, a substrate support assembly disposed in the processing chamber, and a remote plasma source coupled to the processing chamber through an outlet port formed within the chamber wall, the outlet port having an opening pointing toward an periphery region of a substrate disposed on the substrate support assembly, wherein the remote plasma source is fabricated from a material resistant to hydrogen species.

Description

technical field [0001] Embodiments of the invention generally relate to semiconductor processing systems. More specifically, embodiments of the invention relate to semiconductor processing systems for removing polymers from backsides of substrates in semiconductor manufacturing. Background technique [0002] Integrated circuits have grown into complex assemblies that can include millions of components (such as transistors, capacitors, and resistors) on a single chip. The evolution of chip designs continues to require faster circuitry and higher circuit densities. The demand for higher circuit density necessitates a reduction in the size of integrated circuit components. [0003] As the dimensions of integrated circuit features decrease (eg, to sub-micron dimensions), the importance of reducing the presence of contaminants increases because contaminants can lead to the formation of defects during semiconductor manufacturing processes. For example, in an etch process, by-pr...

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Problems solved by technology

However, incomplete removal of the photoresist layer on the front side of the substrate can also contaminate structures formed on the substrate, resulting in yield loss and device failure

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