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Intrinsic flame-retardant epoxy resin composition for semiconductor package

An intrinsic flame retardant and epoxy resin technology is applied in the field of intrinsic flame retardant epoxy resin compositions for semiconductor encapsulation, and can solve the problems of high viscosity of epoxy molding compounds, unfavorable human environment, generation of toxic and harmful gases, etc. Good environmental performance, low viscosity, good fluidity and operability

Inactive Publication Date: 2012-01-04
JIANGSU ZHONGPENG NEW MATERIAL
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

However, halogen flame retardants will produce toxic and harmful gases during the combustion process, which is harmful to the human body and the environment.
Therefore, halogenated flame retardants are gradually replaced by other flame retardants. Phosphorous and metal oxide flame retardants are used more, but the epoxy molding compound added with this flame retardant must reach UL-94V-0 According to the grade standard, a larger amount must be added, resulting in a higher viscosity of the epoxy molding compound, resulting in fluidity and operability that cannot meet the requirements of electronic packaging

Method used

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  • Intrinsic flame-retardant epoxy resin composition for semiconductor package
  • Intrinsic flame-retardant epoxy resin composition for semiconductor package
  • Intrinsic flame-retardant epoxy resin composition for semiconductor package

Examples

Experimental program
Comparison scheme
Effect test

Embodiment 1

[0025] Example 1. An intrinsic flame retardant epoxy resin composition for semiconductor encapsulation, which is composed of the following raw materials in weight ratio,

[0026] Intrinsic flame retardant epoxy resin 5;

[0027] Intrinsic flame retardant phenolic resin 5;

[0028] Inorganic filler 50;

[0029] Curing accelerator 0.5;

[0030] Coupling agent 0.5;

[0031] Colorant 0.1;

[0032] Release agent 0.1;

[0033] Described intrinsic flame retardant type epoxy resin is the epoxy resin of general formula (I):

[0034]

[0035] In general formula (I): R 1 is-CH 3 , R 2 is-CH 2 CH 3 or -CH=CH 2 , n is 1-10;

[0036] Described intrinsic flame retardant type phenolic resin is the phenolic resin of general formula (II):

[0037]

[0038] In general formula (II): R is H, n=1-10.

Embodiment 2

[0039] Example 2. An intrinsic flame retardant epoxy resin composition for semiconductor encapsulation, which is composed of the following raw materials in weight ratio,

[0040] Intrinsic flame retardant epoxy resin 30;

[0041] Intrinsic flame retardant phenolic resin 20;

[0042] Inorganic filler 300;

[0043] curing accelerator 2.5;

[0044] Coupling agent 4.5;

[0045] Colorant 5;

[0046] Release agent 4.5;

[0047] Described intrinsic flame retardant type epoxy resin is the epoxy resin of general formula (I):

[0048]

[0049] In general formula (I): R 1 is -CH=CH 2 , R 2 is-CH 3 or -CH 2 CH 3 , n is 1-10;

[0050] Described intrinsic flame retardant type phenolic resin is the phenolic resin of general formula (II):

[0051]

[0052] In general formula (II): R is CH 3 , n=1-10.

Embodiment 3

[0053] Example 3. An intrinsic flame retardant epoxy resin composition for semiconductor encapsulation, which is composed of the following raw materials in weight ratio,

[0054] Intrinsic flame retardant epoxy resin 20;

[0055] Intrinsic flame retardant phenolic resin 15;

[0056] Inorganic filler 200;

[0057]Curing accelerator 1.5;

[0058] Coupling agent 1.5;

[0059] Colorant 1;

[0060] Release agent 1;

[0061] Described intrinsic flame retardant type epoxy resin is the epoxy resin of general formula (I):

[0062]

[0063] In general formula (I): R 1 is-CH 2 CH 3 , R 2 is-CH 3 or -CH=CH 2 , n is 1-10;

[0064] Described intrinsic flame retardant type phenolic resin is the phenolic resin of general formula (II):

[0065]

[0066] In general formula (II): R is CF 3 , n=1-10.

[0067] Example 3. In the intrinsic flame retardant epoxy resin composition for semiconductor encapsulation described in Example 1: the inorganic filler is spherical silicon m...

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PUM

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Abstract

The invention relates to an intrinsic flame-retardant epoxy resin composition for semiconductor package, which is characterized by comprising the following components in proportion by weight: 5-30 of intrinsic flame-retardant epoxy resin, 5-20 of intrinsic flame-retardant phenolic resin, 50-300 of inorganic filler, 0.5-2.5 of curing accelerator and 0.5-4.5 of coupling agent, wherein the intrinsicflame-retardant epoxy resin is epoxy resin with a general formula (I), R1 and R2 stand for one of -CH3, -CH2CH3 and -CH=CH2, and n is equal to 1-10; and the intrinsic flame-retardant phenolic resin is phenolic resin with a general formula (II), R stands for H, CH3 or CF3, and n is equal to 1-10. The flame retardance of the epoxy resin composition can reach a UL-94V-0 level standard. The intrinsicflame-retardant epoxy resin composition can not generate toxic and harmful gas in a combustion process, has good environmental protection performance, low viscosity, better liquidity and better operability and can satisfy electronic packing requirements.

Description

technical field [0001] The invention relates to an epoxy resin composition, in particular to an intrinsic flame-retardant epoxy resin composition for semiconductor packaging. Background technique [0002] In 2003, the WEEE and RoHS regulations issued by the European Union stipulated that the use of six hazardous materials in discarded electrical or electronic equipment will be banned within a limited period. Japan implements stricter SONY standards. Electronic Information Product Pollution Control Management Measures, the green environmental protection requirements of electronic products have become an irreversible trend. With the improvement of people's awareness of environmental protection, electronic waste has also begun to attract attention, and the environmental protection of epoxy molding compounds as electronic packaging materials has become an irreversible trend. Since the epoxy molding compound contains organic polymer compounds such as epoxy resin, these compounds...

Claims

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Application Information

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Patent Type & Authority Patents(China)
IPC IPC(8): C08L63/00C08L61/06C08K13/02H01L23/29
Inventor 封其立张德伟孙波周佃香吕秀波
Owner JIANGSU ZHONGPENG NEW MATERIAL