Hybrid mesh partition method with design of integrity of system-level packaging power supply

Abstract

The invention relates to a hybrid mesh partition method in the field of electronic technologies, in particular to the hybrid mesh partition method with the design of integrity of a system-level packaging power supply. The hybrid mesh partition method comprises the following steps: (1) decomposing an irregular power supply / ground plane into a series of convex polygons by utilizing convex partition treatment; (2) obtaining an optimal rectangular mesh based on the recursive partitioning technology of the rectangular mesh, setting auxiliary ports on sides of the rectangular mesh, and establishing the transfer impedance relationship among the ports; (3) adopting a triangular mesh to fill the remaining structure, and carrying out modeling of an equivalent circuit for the triangular mesh; (4) establishing the electrical relationship among the ports at an interface of the rectangular mesh and the triangular mesh; and (5) solving simultaneous overall equations. The hybrid mesh partition method has the advantages of a wide range of applications, few internal nodes, high analysis precision and efficiency and the like.

Description

technical field [0001] The invention relates to a hybrid grid division method in the field of electronic technology, in particular to a hybrid grid division method for system-in-package power integrity design. Background technique [0002] With the development of electronic packaging and integration technology, the system-in-package technology that has been widely concerned can integrate high-speed digital devices, RF / analog devices, MEMS devices, and optoelectronic devices into one package to realize complex system functions. Since various components and functional blocks work together in the system, power integrity issues are a prominent challenge in system-in-package design. For example, when the same power supply is used in the system-in-package to power digital circuits and RF / analog circuits, the power / ground plane will become the main source of noise coupling. Synchronous switching noise in digital circuits will cause voltage fluctuations in the power distribution n...

AI Technical Summary

Problems solved by technology

This method uses T-shaped or ∏-shaped circuit units to perform equivalent planes, and has good versatility. The disadvantage is that the circuit network is too complex and the number of components is large, which makes the simulation time and memory usage are large.

[0004] Therefore, the current power integrity design and analysis methods cannot take into account the two aspects of versatility and efficiency at the same time, and new technologies need to be developed to meet the design requirements of arbitrary shape power / ground planes in system-in-packages

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