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Production method of thin prepreg with high-content filler adhesive system

A prepreg, production method technology, applied in chemical instruments and methods, layered products, circuit substrate materials, etc., can solve problems such as increasing product manufacturing costs, increasing the risk of product quality problems, and affecting the electrical insulation performance of PCB boards. Ensure electrical performance and reliability, solve apparent pinhole defects, and ensure the effect of electrical insulation performance

Active Publication Date: 2011-04-27
GUANGDONG SHENGYI SCI TECH
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

[0012] For the above prepreg pinhole problem, it is difficult to have a significant improvement effect by adjusting the index of the glue system and setting the parameters of the glue machine.
Therefore, the qualified rate of producing thin prepreg is greatly reduced due to apparent quality problems, which increases the manufacturing cost of the product
The use of prepreg with apparent pinhole defects to press the board, especially for the board with a single prepreg composition structure, will affect the electrical properties and reliability of the copper clad laminate itself, which in turn will affect the electrical insulation performance of the PCB board, undoubtedly increasing the product quality. risk of quality problems

Method used

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  • Production method of thin prepreg with high-content filler adhesive system
  • Production method of thin prepreg with high-content filler adhesive system
  • Production method of thin prepreg with high-content filler adhesive system

Examples

Experimental program
Comparison scheme
Effect test

Embodiment 1

[0047] Preparation of resin glue with high content of fillers, wherein the weight percentage of fillers in the total components is 20%, and the void area of ​​warp and weft yarns is 0.005-0.008mm 2 The 106 thin electronic-grade glass fiber flat cloth (flat and thin 106) is soaked in the resin glue solution with high filler content, and baked to obtain a thin prepreg with a resin content of 71% and a 106 high filler glue system. The prepared prepreg Compared with the prepreg using ordinary thin 106 glass fiber cloth, there is no pinhole problem in its appearance, which improves the qualified rate of the product. The comparison is shown in Table 4 below:

[0048] Table 4, the appearance contrast of prepreg of the present invention and existing prepreg

[0049]

Embodiment 2

[0051] On the basis of Example 1, a novolac resin curing agent with a number average molecular weight ranging from 1200 to 2000 is used in the resin glue with a high content of filler, and 106 thin electronic grade glass fiber flat cloth (flat and thin 106) is used to infiltrate In the resin glue solution with high filler content, a thin prepreg with a resin content of 71% and a 106 high filler glue system is baked. Compared with a prepreg made of ordinary thin 106 glass fiber cloth, the prepreg has The appearance can completely avoid pinhole defects, greatly improving the pass rate of products. The comparison is shown in Table 5 below:

[0052] Table 5, the appearance contrast of prepreg of the present invention and existing prepreg

[0053]

[0054] To sum up, the production method of the thin prepreg with high content of filler adhesive system of the present invention effectively solves the apparent pinhole defects of the thin prepreg, improves its qualification rate, a...

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Abstract

The invention relates to a production method of thin prepreg with a high-content filler adhesive system, comprising the following steps: step 1, providing an electronic-grade fiberglass flat cloth, wherein the nominal mass per unit of the electronic-grade fiberglass flat cloth is 15-50g / m<2>, and the weft clearance area is 0-0.01mm<2>; step 2, preparing a resin adhesive solution containing a high-content filler, wherein the filler accounts for 15-60% by weight; and step 3, impregnating the electronic-grade fiberglass flat cloth in the resin adhesive solution containing a high-content filler, and baking to obtain the thin prepreg with a high-content filler adhesive system. The production method of the thin prepreg with a high-content filler adhesive system provided by the invention effectively solves the apparent pinhole defect of the thin prepreg, improves the percent of pass, and ensures the electrical property and reliability of a copper-clad plate made from the thin prepreg, thereby ensuring the electrical insulation property of a printed circuit board (PCB) and improving the quality of products.

Description

technical field [0001] The invention relates to the field of copper clad laminates, in particular to a production method of a thin prepreg with a high content of filler glue system. Background technique [0002] Copper-clad laminates, as the basic material of printed circuit boards, are reinforced materials (such as electronic-grade glass fiber cloth) impregnated with resin (glue), which are baked into prepregs with a certain degree of curing, and then a One or more prepregs are stacked together according to certain structural requirements, and one or both sides are covered with copper foil, and a composite material is made by hot pressing. [0003] In IPC4412, "Specifications for Handling E Glass Fiber Cloth for Printed Boards" clearly stipulates the type of glass fiber cloth. The types of glass fiber commonly used as reinforcing materials for electrical and electronic laminates are listed in the following table 1: [0004] Table 1. Basic physical properties of commonly us...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): C08L101/00C08K13/04C08K7/14C08K3/22C08K3/36C08K3/34C08K3/02C08K3/26C08L63/00C08L33/04C08L67/00C08L75/04C08L79/08C08L61/06B29C70/40B32B15/08H05K1/03
Inventor 黄伟壮
Owner GUANGDONG SHENGYI SCI TECH
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