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Conductive paste and method of manufacturing printed circuit board using the same

A technology of conductive adhesive and conductive powder, applied in the directions of printed circuit, printed circuit, printed circuit manufacturing, etc., can solve the problems of bump breakage, increase of interlayer insulation distance, and inability to ensure interlayer insulation distance, etc.

Inactive Publication Date: 2011-04-27
SAMSUNG ELECTRO MECHANICS CO LTD
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

In the case of increasing the amount of powder to improve the resistivity when penetrating the insulating layer, bump collapse will occur, and in the case of realizing a multilayer substrate by co-stacking, the interlayer insulation distance cannot be ensured
In order to reduce the resistivity, the amount of powder should be increased, in this case, conversely, since the bumps are not easily compressed when pressurized, the interlayer insulation distance is increased and the bumps may break due to excessive pressure

Method used

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  • Conductive paste and method of manufacturing printed circuit board using the same
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  • Conductive paste and method of manufacturing printed circuit board using the same

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Embodiment Construction

[0044] Functions, effects, and technical configurations of a conductive paste and a method of manufacturing a printed circuit board using the same according to the present invention will be clearly understood through the following detailed description with reference to the accompanying drawings showing preferred embodiments of the present invention.

[0045] In the following, reference will be made to Figure 1 to Figure 6 A conductive adhesive and a method of manufacturing a printed circuit board using the conductive adhesive according to an embodiment of the present invention will be described in detail.

[0046] first, figure 1 is a diagram schematically showing a conductive paste according to an embodiment of the present invention.

[0047] like figure 1 As shown, the conductive adhesive 60 according to the embodiment of the present invention includes: conductive powder 40, having a polymer powder 10 and a first low-melting-point metal 20 and a second metal with differen...

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Abstract

The present invention provides a conductive paste including: a conductive powder particle including a polymer powder and a first low melting point metal and a second low melting point metal which are sequentially provided on a surface of the polymer powder and have different melting points; and a binder mixed in the conductive powder particle, and a method of manufacturing a printed circuit board using the same.

Description

[0001] Cross References to Related Applications [0002] This application claims priority from Korean Patent Application No. 10-2009-0093189 filed with the Korean Intellectual Property Office on Sep. 30, 2009, the disclosure of which is incorporated herein by reference. technical field [0003] The present invention relates to a conductive adhesive and a method of manufacturing a printed circuit board using the same, and more particularly, to a conductive adhesive including two low-melting metals having different melting points and a method of manufacturing a printed circuit board using the conductive adhesive. Background technique [0004] Currently, a large number of passive components and high-density multilayer packages are mounted on printed circuit boards (PCBs) due to thickness reduction and functionalization of electronic products, and this trend will continue in the future. [0005] Basically, the PCB plays the role of connecting various electronic components to the...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): C09J163/00C09J161/06C09J9/02H05K3/46
CPCH05K1/095H05K2201/0129H05K2203/0425H01B1/22H01B1/02H05K2201/0355H05K2201/0272H05K2201/0221H05K3/4647H05K3/4069H05K3/40H05K3/46
Inventor 黄俊午睦智秀李应硕
Owner SAMSUNG ELECTRO MECHANICS CO LTD
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