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Multi-layer HDI circuit board blind hole windowing process

A window-opening process and circuit board technology, which is applied in printed circuits, printed circuit manufacturing, electrical components, etc., can solve the problems of unstable quality and insufficient laser blind hole window opening accuracy, so as to reduce the manufacturing difficulty and ensure blind hole opening. Window quality and blind hole quality, the effect of optimizing the operation process

Inactive Publication Date: 2011-04-27
惠州中京电子科技股份有限公司
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

[0003] The invention aims to solve the problems of insufficient precision and unstable quality of laser blind hole opening in the prior art, and further provide a laser blind hole window opening process with simple process flow, good quality stability and low production cost

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  • Multi-layer HDI circuit board blind hole windowing process
  • Multi-layer HDI circuit board blind hole windowing process

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Embodiment Construction

[0016] In order to facilitate the understanding of those skilled in the art, the present invention will be further described in detail below in conjunction with specific embodiments and accompanying drawings:

[0017] The laser blind hole window opening process steps of the multi-layer HDI circuit board disclosed by the present invention are as follows:

[0018] (1) Make the target hole pattern on the PAD layer at the bottom of the laser blind hole;

[0019] (2) Use LD PP or RCC resin copper foil for lamination;

[0020] (3) Use X-RAY machine to drill target holes;

[0021] (4) Use automatic exposure machine for alignment and exposure;

[0022] (5) Development;

[0023] (6) Blind hole etching window opening.

[0024] In this process, four key technologies need to be overcome, namely: sub-outer layer target hole pattern making, X-RAY machine targeting hole, automatic exposure machine alignment and exposure, blind hole etching and window opening.

[0025] In process step 1 ...

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Abstract

The invention discloses a multi-layer high density interconnector (HDI) circuit board blind hole windowing process, which comprises the following steps of: manufacturing a target hole pattern on a PAD layer at the bottom of a laser blind hole; laminating by adopting a resin copper foil, drilling a target hole by adopting an X-RAY machine, and aligning and exposing by adopting an automatic exposure machine; and finally, developing, and etching for windowing. The process breaks through the conventional laser blind hole processing mode (positioning by adopting three tube holes and drilling the laser blind hole windowing and positioning hole through mechanical drilling), four target holes of a plate corner positioned on the same plane as the PAD layer at the bottom of the laser blind hole are accurately aligned, the target holes are drilled by an X-RAY precise drilling machine, repeated use and mechanical drilling error for outer tube holes are avoided, and the aim of accurately windowing the laser blind hole is fulfilled finally. The process is simple and the efficiency is high.

Description

technical field [0001] The invention relates to printed circuit board technology, in particular to a blind-hole window-opening manufacturing process of a multilayer HDI printed circuit board. Background technique [0002] Whether the PCB substrate can be high-density depends on the micro-holes and lines connected between layers, and it depends on the performance of electronic products. Therefore, the laser blind hole opening technology of PCB boards has become one of the key technologies for making micro-holes. In the industry, the traditional laser blind hole window opening method is mainly to achieve the window alignment of laser blind holes by drilling the alignment holes of the clapper board, which requires an increase in the mechanical drilling process. However, due to the impact of objective factors such as the quality of the drill bit, drilling parameters, employee operations, and the storage environment of the board, the alignment hole of the mechanical drill will ca...

Claims

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Application Information

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IPC IPC(8): H05K3/40
CPCH05K2203/166H05K3/0035H05K3/4652
Inventor 周刚赵志平
Owner 惠州中京电子科技股份有限公司
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