Heating shoe
A technology for soles and uppers, applied in footwear, ohmic resistance heating parts, clothing, etc., can solve the problems of unreasonable selection and layout, the overall structure of heating shoes is huge, and cannot meet the needs of pursuit, and the thickness of the structure can be achieved. The effect of compactness, flexibility and ease of use, and the requirement to reduce the thickness of the sole
- Summary
- Abstract
- Description
- Claims
- Application Information
AI Technical Summary
Problems solved by technology
Method used
Image
Examples
Embodiment Construction
[0022] Please refer to figure 1 and figure 2 As shown, it shows the specific structure of the preferred embodiment of the present invention, a heating shoe, including a sole 10 and a vamp 80, the upper surface of the sole 11 of the sole 10 is concavely formed with a first accommodating The concave cavity 101, the upper surface of the heel 12 of the sole 10 is concavely formed with a second accommodating cavity 102, and the upper surface of the sole 10 is preferably provided with a wire groove 103 for accommodating wires.
[0023] A heat generating film 20 is placed in the first receiving cavity 101 .
[0024] A high-energy rechargeable battery 30 is placed in the second accommodating cavity 102 , and the high-energy rechargeable battery 30 is connected to the heat-generating film 20 through a wire 40 ;
[0025] The entire upper surface of the sole 10 is covered with a heat conduction sheet 50, which is covered on the aforementioned first accommodation cavity 101 and second ...
PUM
Abstract
Description
Claims
Application Information
- R&D Engineer
- R&D Manager
- IP Professional
- Industry Leading Data Capabilities
- Powerful AI technology
- Patent DNA Extraction
Browse by: Latest US Patents, China's latest patents, Technical Efficacy Thesaurus, Application Domain, Technology Topic, Popular Technical Reports.
© 2024 PatSnap. All rights reserved.Legal|Privacy policy|Modern Slavery Act Transparency Statement|Sitemap|About US| Contact US: help@patsnap.com