Method for soldering TiAlC ceramic and copper by using Ag-Cu eutectic solder

A technology of ag-cu and brazing material, which is applied in the field of brazing Ti2AlC ceramics and copper, can solve the problems of short life, high cost of current-carrying friction devices, etc., and achieve good conductivity

Inactive Publication Date: 2011-05-18
HARBIN INST OF TECH
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

[0005] The invention provides the use of Ag-Cu eutectic solder to braze Ti 2 AlC ceramics and copper methods to achieve a Ti 2 The high-strength and high-conductivity connection of AlC ceramics and Cu solves the problems of high cost and short life of current-carrying friction devices in existing engineering applications

Method used

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  • Method for soldering TiAlC ceramic and copper by using Ag-Cu eutectic solder

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specific Embodiment approach 1

[0013] Specific implementation mode 1: This implementation mode uses Ag-Cu eutectic solder to braze Ti 2 The method of AlC ceramics and copper is realized through the following steps: one, the Ti 2 AlC ceramics were polished to a bright surface with 320#, 600#, 800#, 1000#, 1200# and 1600# metallographic sandpaper in sequence, and then Ti 2 The surface to be connected of AlC ceramics is polished; then the copper is polished to a bright surface with 1000# and 1600# metallographic sandpaper successively, and then the diamond polishing agent of 0.5 μm is used to polish the surface to be connected of the copper; 2. After step 1 Treated Ti 2 Immerse AlC ceramics and copper in absolute ethanol, ultrasonically clean them for 10-20 minutes, take them out, and dry them in the air; 3. Put Ag-Cu eutectic solder, Ti 2 Assembly of AlC ceramic and copper into Ti 2 The structure of AlC ceramics / Ag-Cu eutectic solder / copper is then assembled with a pressure head to obtain a brazing assembl...

specific Embodiment approach 2

[0017] Embodiment 2: This embodiment differs from Embodiment 1 in that the Ag-Cu eutectic solder described in step 3 is Ag-Cu eutectic powder solder or Ag-Cu eutectic foil. Other steps and parameters are the same as those in Embodiment 1.

specific Embodiment approach 3

[0018] Specific embodiment three: the difference between this embodiment and specific embodiment one is that the Ag-Cu eutectic solder described in step three is Ag-Cu eutectic powder solder, and the preparation method of the brazing assembly is: Cu eutectic powder solder and hydroxyethyl cellulose binder are mixed to obtain paste-like Ag-Cu eutectic solder, and then the paste-like Ag-Cu eutectic solder is coated on Ti 2 The Ag-Cu eutectic solder layer is formed on the surface to be connected of AlC ceramics and the surface to be connected of copper, and then the Ti 2 The Ag-Cu eutectic solder layer on the surface to be connected of AlC ceramics is bonded with the Ag-Cu eutectic solder layer on the surface to be connected of copper, and assembled into Ti 2 The structure of AlC ceramic / Ag-Cu eutectic solder / copper is then assembled with an indenter to obtain a brazed assembly. Other steps and parameters are the same as those in Embodiment 1.

[0019] In this embodiment, the h...

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Abstract

The invention discloses a method for soldering TiAlC ceramic and copper by using Ag-Cu eutectic solder, relating to a method for soldering TiAlC ceramic and copper and realizing high-strength and high-conductivity connection of the TiAlC ceramic and the copper. The method comprises the steps of: respectively grinding, polishing and cleaning the TiAlC ceramic and the copper, assembling the TiAlC ceramic, the Ag-Cu eutectic solder and the copper into a soldering assembling member, and then placing in a vacuum soldering furnace for soldering. The invention successfully realizes the connection of the TiAlC ceramic and the copper, and ensures joint compression shearing strength of 89.3-203.3MPa, conductivity of 5.034*10<6>-6.523*10<6>S / m, high joint strength and good conductivity. A joint of the TiAlC ceramic and the copper is used for current-carrying friction elements, and the general problems of high cost and shorter service life of the current-carrying friction elements applied to the traditional engineering can be solved.

Description

technical field [0001] The invention relates to a brazing Ti 2 Methods for AlC ceramics and copper. Background technique [0002] Ti 2 AlC ceramics are ternary layered ceramics M n+1 AX n One of them, it is a structural / functional integrated ceramic with both metal and ceramic properties. Ti 2 The space lattice of AlC ceramics is hexagonal, and the space group is P6 3 / mmc, by Ti 6 C octahedral layers and two-dimensional closely packed Al atomic layers are arranged alternately. Firstly, the Ti atoms and Al atoms are combined by van der Waals force, which makes the ceramic have a layered structure and good self-lubricating properties; secondly, the Ti atoms and C atoms are covalently bonded, and the Ti-C bond is firm. The combination endows the ceramic with excellent physical, chemical and mechanical properties, such as high melting point, high thermal stability; good oxidation resistance; high modulus of elasticity and high yield strength. In addition, Al atoms and ...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): C04B37/02
Inventor 张杰王国超
Owner HARBIN INST OF TECH
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