Solder removing liquid, preparation method and application thereof

A technology of tin stripping and stannic acid, which is applied in the field of tin stripping liquid and its preparation, can solve the problems that it is not suitable for removing the solder of waste circuit boards, affects the desoldering β-stannic acid, and easily produces tetravalent tin ions, etc., and achieves the goal of preparing Low cost, good for recycling, fast dissolution

Inactive Publication Date: 2011-05-18
GEM CO LTD
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

But this method has the following problems: the single strong acid used is easy to oxidize the divalent tin ions in the solder to tetravalent, and no stabilizer is added in this method to cooperate with a single strong acid, so it is easy to produce tetravalent tin ions, tetravalent tin ions Hydrolysis will produce β-stannic acid precipitation prematurely, and the β-stannic acid precipitation will adhere to the solder surface and affect the progress of desoldering, which will slow down the desoldering speed
[0006] It can be seen that using a single strong acid to desolder the waste circuit board is easy to produce β-stannic acid that affects the desoldering process, and the desoldering speed is slow
At the same time, the solder stripping solutions sold on the market are weak in oxidation and complex in composition, so they are not suitable for directly removing solder from waste circuit boards

Method used

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Examples

Experimental program
Comparison scheme
Effect test

Embodiment 1

[0029] A kind of tin stripping liquid, comprises following components and percentage by weight:

[0030] Nitric acid 15%,

[0031] Iron Nitrate 20%,

[0032] Sulfonic acid 1%,

[0033] The rest is water.

[0034] The mass percent of the nitric acid selected is 68%.

Embodiment 2

[0036] A preparation method of a tin stripping solution, comprising completely dissolving ferric chloride and sulfonic acid in water according to the following components and weight percentages, adding nitric acid, and stirring evenly to obtain a tin stripping solution: 30% nitric acid, 10% ferric chloride %, sulfonic acid 3%, and the rest is water. The mass percent of the nitric acid selected is 68%.

Embodiment 3

[0038] The application of a tin stripping solution is to desolder the waste circuit boards, specifically: after cleaning and drying the waste circuit boards, soak them in the tin stripping solution for 10-25 minutes for desoldering treatment, and then the waste circuit boards can be removed Solder removal on the. The tin stripping solution contains the following components and percentages by weight: 50% nitric acid, 18% ferric nitrate, 5% sulfonic acid, and the rest is water. The mass percent of the nitric acid selected is 68%.

[0039] After the waste circuit board is desoldered by the tin stripping solution, it can be disassembled into substrates and components, and enter the recycling process. The waste tin stripping solution formed during the desoldering process is transferred to the recovery tank to stand still, and after standing still, β-stannic acid precipitation and waste acid solution are obtained. The β-stannic acid precipitation is used to recover tin metal, and ...

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PUM

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Abstract

The invention provides solder removing liquid, a preparation method and application thereof. The solder removing liquid comprises the following components in percentage by weight: 15-50 percent of nitric acid, 1-20 percent of ferric nitrate or ferric chloride, 1-5 percent of sulfoacid and the balance of water. The solder removing liquid provided by the invention has the advantages of strong oxidability, high speed of dissolving solder, simpleness and easiness of raw materials, low preparation cost, no containing of a stabilizing agent and simple formulation and favorability of recycling valuable metals in waste liquid; and the waste solder removing liquid formed after desoldering can stand to generate beta-stannic acid sediment and is convenient for recovering tin metal.

Description

technical field [0001] The invention relates to a non-mechanical method for removing metal materials on the surface of waste circuit boards, in particular to a tin stripping solution and its preparation method and application. Background technique [0002] With the improvement of people's living standards, the frequency of replacement of various household appliances is getting higher and higher, and the number of waste circuit boards produced by various waste household appliances is increasing. How to effectively deal with waste circuit boards and realize the recycling and reuse of waste circuit boards has become an urgent problem to be solved. [0003] The core issue in realizing the recycling of waste circuit boards is to desolder the waste circuit boards and remove the solder on the surface of the waste circuit boards. Wet desoldering has the advantages of low energy consumption and complete desoldering. For example, the Chinese patent with the publication number CN1016...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): C23F1/30
Inventor 关豪元许开华黄旭江
Owner GEM CO LTD
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