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Heat pump

A technology of heat pumps and heat exchangers, applied in heat pumps, pumps, rotary piston pumps, etc., can solve problems such as inability to fully utilize cooling/heating capacity, high equipment costs, and reduced heating performance, so as to ensure performance and safety performance, improved heating capacity, improved performance and efficiency

Active Publication Date: 2011-05-18
LG ELECTRONICS INC
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

[0005] However, heat pumps according to conventional technologies may not be able to fully exert their cooling / heating capacity when the cooling / heating load such as outdoor temperature changes.
For example, there is a problem that the heating performance drops a lot in cold regions
If the heat pump is replaced with a large-capacity heat pump or a new heat pump is added, there is a problem that the equipment cost is high and the installation space needs to be secured

Method used

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Embodiment Construction

[0033] By referring to and attaching Figure 1 The advantages, features, and methods for realizing them of the present invention will become clear from the embodiments described later in detail.

[0034] Hereinafter, embodiments of the present invention will be described in detail with reference to the accompanying drawings. Next, an air conditioner for heating (hereinafter referred to as "air conditioner") will be described as an example of the heat pump.

[0035] figure 1 is a block diagram of the air conditioner 100 according to the first embodiment of the present invention.

[0036] refer to figure 1 , the above-mentioned air conditioner 100 includes: a main circuit, which includes a scroll compression part 10, a condenser 20, a first expansion device 30, a second expansion device 40, and an evaporator 70, wherein the condenser 20 passes through the above-mentioned scroll compression The refrigerant in the machine part 10 is condensed, the first expansion device 30 thr...

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Abstract

The heat pump according to the present invention comprises a scroll compressor, and injects refrigerant to the scroll compressor by using the first refrigerant injection flow path and the second refrigerant injection flow path. By injecting refrigerant, an efficiency of the heat pump can be improved as compared with non-injection. Thus, a heating performance can be improved also in the extremely cold environmental condition such as the cold area. Also, because refrigerant is injected twice by using the first refrigerant injection flow path and the second refrigerant injection flow path, heating performance can be improved by increasing the injection flow rate.

Description

technical field [0001] The present invention relates to a heat pump, in particular to a heat pump capable of improving system performance and efficiency. Background technique [0002] Generally, a heat pump is a device that cools or heats an indoor space by compressing, condensing, expanding, and evaporating a refrigerant. [0003] The above heat pumps are classified into a normal air conditioner in which one indoor unit is connected to an outdoor unit and a multi-type air conditioner in which a plurality of indoor units are connected to an outdoor unit. In addition, the heat pump described above may further include a hot water supply unit for supplying hot water and a heating unit for heating a floor by supplying the hot water. [0004] The above-mentioned heat pump includes a compressor, a condenser, an expansion valve, and an evaporator. The refrigerant discharged from the compressor is condensed in the condenser, and then expanded in the expansion valve. The expanded ...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): F25B30/02F25B41/06
CPCF25B1/04F25B2339/047F25B2400/13F25B2341/066F25B1/10F25B30/02F25B2400/23F25B41/385F25B41/39F04C18/02F25B49/02
Inventor 高永桓朴相炅张龙熙金范锡
Owner LG ELECTRONICS INC