Method for manufacturing copper cylinder through pattern transfer

Abstract

The invention discloses a method for manufacturing a copper cylinder through pattern transfer, which solves the problems in the prior art that a copper cylinder is tightly combined with a metal layer during pattern plating of the copper cylinder, and in the post process step manufacturing process, skip plating is reduced, stripping and falling are generated and the like, so as to realize inter-layer smooth interconnection. The method particularly comprises the following steps of: attaching a photosensitive anticorrosive additive on the surface of a metal layer to form a photosensitive pattern; performing thermo-curing to reinforce the sensitized photosensitive anticorrosive additive; and dissolving the unexposed photosensitive anticorrosive additive in weak alkaline solution, and cleaning the surface of the exposed metal layer. The method provided by the invention can increase the roughness of a gold surface, thereby enhancing the bonding capacity of gold threads, and simultaneously solving the problem of outlook defects generated therefrom.

Description

technical field [0001] The invention belongs to the field of production and production of packaging substrates, in particular a copper column pattern transfer manufacturing method applied to packaging substrates. Background technique [0002] In the packaging substrate process, the copper pillar lamination method will be used. This method has high connection stability and is less affected by the external environment of the packaging substrate application. In the process of using copper pillar build-up method, the height of copper pillars affects the thickness of the dielectric layer of the packaging substrate. At present, the application in this field is mainly for the dry film thickness less than 75um, and the copper pillar pattern transfer with the dry film thickness higher than 75um During production, problems such as disconnection and disconnection often occur due to electroplating leaks and poor bonding of copper pillars and metal layers. [0003] In the prior art, the...

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Problems solved by technology

[0004] In order to solve the problems existing in the prior art, the present invention proposes a copper column pattern transfer manufacturing method, which solves the problem in the prior art that the copper column and the metal layer are closely combined when the pattern is electroplated on the copper column, and reduces leakage in the post-production process. Plating, peeling off and other problems, in order to achieve smooth interconnection between layers

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