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Insulated gate bipolar transistor (IGBT)

A technology of bipolar transistors and insulated gates, which is applied to semiconductor devices, electrical components, circuits, etc., can solve the problems of large on-state loss and achieve the effects of small conduction loss, reduced on-state resistance, and reduced on-state loss

Inactive Publication Date: 2011-05-18
ZHEJIANG UNIV
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

[0003] However, existing insulated gate bipolar transistors in the market all have the situation that the withstand voltage capability is inconsistent with the on-state voltage drop, that is, the on-state loss of the high withstand voltage insulated gate bipolar transistor device is also very large. The present invention proposes a Insulated gate bipolar transistors have achieved a good compromise between withstand voltage and on-state loss

Method used

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  • Insulated gate bipolar transistor (IGBT)
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  • Insulated gate bipolar transistor (IGBT)

Examples

Experimental program
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Effect test

Embodiment 1

[0012] Such as figure 1 As shown, the bottom of the insulated gate bipolar transistor of the present invention is the collector 1 , and upwards are the collector region 2 , the buffer layer 3 , the drift region 4 , the P well region 6 and the emitter region 7 . SiO 2 The insulating layer 5 penetrates laterally into the P well region 6 and the drift region 4, the top of the emitter region 7 is covered with an emitter 8, and the gate 9 straddles the emitter region 7, the P well region 6 and the drift region 4, and the gate 9 is Among the polysilicon 10.

[0013] When the insulated gate bipolar transistor is working, the collector region 2 injects holes into the drift region 4 to form conductance modulation, and the holes drift toward the emitter 8 under the positive pressure of the collector 1, and are absorbed by the insulating layer when entering the P well region 6 5 barriers, a large number of holes along the SiO 2 As the insulating layer 5 moves laterally, the holes accu...

Embodiment 2

[0015] Such as figure 2 As shown, the bottom of the insulated gate bipolar transistor of the present invention is the collector 1 , and upwards are the collector region 2 , the buffer layer 3 , the drift region 4 , the P well region 6 and the emitter region 7 . SiO 2 The insulating layer 5 penetrates the drift region 4 laterally near the P well region 6, the top of the emitter region 7 is covered with an emitter 8, the gate 9 spans the emitter region 7, the P well region 6 and the drift region 4, and the gate 9 is in the polysilicon 10 .

[0016] When the insulated gate bipolar transistor is working, the collector region 2 injects holes into the drift region 4 to form conductance modulation, and the holes drift toward the emitter 8 under the positive pressure of the collector 1, and are trapped under the P well region 6 by the insulating layer 5 barriers, a large number of holes along the SiO 2 As the insulating layer 5 moves laterally, the holes accumulate accordingly, th...

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Abstract

The invention discloses an insulated gate bipolar transistor (IGBT). The IGBT is characterized in that a collector is arranged at the bottom of the IGBT; a collection region, a buffer layer, a drift region, a P well region and an emitter region are integrated from the collector to the top in sequence; an emitter covers the top of the emitter region; a gate 9 crosses over the emitter region, the P well region and the drift region; the gate is arranged in polysilicon; and an SiO2 insulating layer transversely penetrates through the drift region or simultaneously transversely penetrates through the P well region and the drift region. The IGBT has the following beneficial effects: on the basis of the common IGBT, an SiO2 insulating layer is added inside the device, thus reducing the on-state voltage drop under the condition of not losing the off-state voltage of the IGBT, effectively reducing the on-state resistance of the IGBT and further reducing the conduction losses of the IGBT; and the process in industrial production is not complex and can conduce to saving more production cost compared with the technology conducing to reducing the on-state losses of the IGBT, namely improving the working performance of the IGBT at a relatively low cost.

Description

technical field [0001] The invention relates to the technical field of power electronics, in particular to an insulated gate bipolar transistor suitable for use in converter systems with DC voltages of 600V and above, such as AC motors, frequency converters, switching power supplies, lighting circuits, and traction drives. Background technique [0002] The insulated gate bipolar transistor (IGBT) is mainly composed of a collector region, an emitter region, a channel region, and a drift region. By applying a positive voltage to the gate to form a conductive channel, the IGBT is turned on, and the collector region is injected into the drift region. The conductance of the holes is modulated, so that the IGBT has a lower on-state voltage drop than the previous power MOS devices at high voltages. [0003] However, existing insulated gate bipolar transistors in the market all have the situation that the withstand voltage capability is inconsistent with the on-state voltage drop, t...

Claims

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Application Information

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IPC IPC(8): H01L29/739H01L29/06
Inventor 盛况崔京京郭清
Owner ZHEJIANG UNIV