The invention discloses a method for manufacturing an
insulated gate bipolar transistor (IGBT) component combined with a
fast recovery diode (FRD). The method comprises the steps of defining
exposure of a
trench gate, growing and
doping N-type
polycrystalline silicon,
etching the polycrystalline gate, conducting injection and drive-in to a source and a P trap in the front, reducing
silicon slices at the back, conducting the
phosphonium ion injection at the back, conducting the
phosphonium ion drive-in at the back under a high temperature and for a long time at the back, digging a groove at the back, growing and highly
doping N-type
polycrystalline silicon in the groove at the back, conducting the collector
electrode B injection at the back, and conducting the collector
electrode B drive-in and the collector
electrode gold
evaporation. The IGBT component manufacturing method has a larger
substrate concentration of the IGBT component and a lower cost than the prior art. The PNP base width of the IGBT combined with the
fast recovery diode is smaller than that of a common IGBT, on-state resistance is smaller, generated
joule heat is smaller, dropping detention time is shorter and bearable short-circuit current is larger under the same
voltage during off-state.