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55results about How to "Resistant to breakage" patented technology

Compound bows

Improved compound bows which are smaller, more compact, lighter, and more easily handled and serviced than compound bows of conventional construction but are nevertheless capable of propelling an arrow at an equal or higher velocity and with comparable or greater accuracy than a conventional bow. The improved bows are quieter than those of conventional construction and less apt to snag on brush or other obstacles. They have a rigid riser with ends to which string cams are rotatably mounted and cam-associated power units mounted to and towards the ends of the riser. Each power unit has a component which is elastically deformed to store potential energy as the bow is drawn and a power cable connecting the power storing component to the associated string cam. A bow string extends between and is connected at its opposite ends to the string cams. As the bow is drawn, the string cams are rotated in counter directions, pulling on the power unit cables and thereby elastically deforming and storing potential energy in the power unit components. When the bow string is subsequently released, the elastically deformable power unit components restore to rest configurations, this converting the stored potential energy to arrow propelling kinetic energy. A timing cable arrangement insures that the cams are synchronized to rotate in unison, avoiding the unwanted nock travel that might otherwise occur; and the power units have an adjustment feature which allows the force required to fully draw the bow to be changed.
Owner:STEVENS SIMS INC

Wiring board and semiconductor device excellent in folding endurance

A wiring board with folding endurance includes an insulating film and a copper-containing wiring pattern on a surface of the insulating film, and includes an insulating resin coating layer formed on the wiring pattern such that terminals are exposed. The wiring board has any of the constitutions (A), (B), (C) and (D) below. (A) The wiring pattern includes copper particles having a mean crystal particle diameter in the range of from 0.65 to 0.85 μm as determined by EBSP; not more than 1% of the volume of the wiring pattern is accounted for by copper crystal particles having a particle diameter of less than 1.0 μm as determined by EBSP; and copper crystal particles that are [100] oriented in the longitudinal direction of a lead of the wiring pattern account for from 10 to 20% of the volume of the wiring pattern as determined by EBSP. (B) The insulating film is formed of a polyimide film having a tensile strength within the range of from 450 to 600 MPa and a Young's modulus within the range of from 8500 to 9500 MPa. (C) The insulating film is formed of a polyimide film having a thickness of from 10 to 30 μm. (D) The insulating resin coating layer has a thickness of from 50 to 150% relative to the thickness of the insulating film.
Owner:MITSUI MINING & SMELTING CO LTD
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