Planar magnetic-control sputtering target improving utilization efficiency

A technology of magnetron sputtering and high utilization rate, applied in the field of planar sputtering targets, can solve the problems of non-reusable materials, waste of target materials, high cost of film manufacturing, etc.

Active Publication Date: 2011-05-25
ZHEJIANG TIANCHONG VEHICLE LAMP GROUP
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

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Problems solved by technology

In addition, there are some functional films, such as ITO film, polysilicon film, superhard film, electrode film, etc. In these films, some expensive targets are used, such as gold target, silver target and other precious metal targets. However, in ordinary magnetron sputtering In the sputtering equipment, the magnetic field design of the planar target is basica...

Method used

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  • Planar magnetic-control sputtering target improving utilization efficiency
  • Planar magnetic-control sputtering target improving utilization efficiency
  • Planar magnetic-control sputtering target improving utilization efficiency

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Embodiment Construction

[0016] The invention relates to a planar magnetron sputtering target with improved utilization rate, such as Figure 1-Figure 9 As shown, it is characterized in that it includes a target magnetron jacket 4, the bottom surface of the target magnetron jacket 4 is connected to a cover plate 15, there is cooling water between the cover plate 15 and the target magnetron jacket 4, and the target magnetron A magnetron 7 is placed inside the tube jacket 4, and a water hole 8 is formed in the magnetron 7. A permanent magnet 6 is installed on the magnetron 7, and a target bar 1 is installed on the magnetron jacket 4 of the target material, and there is a target material on the outside of the target bar. Bar fixing block 11, the target material bars 1 are arranged in parallel and alternately, the target material bars overlap each other, the surface of the target material bar 1 is a flat surface, and there are The target shield 10 , the magnetic poles of the permanent magnet 6 connected t...

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Abstract

The invention discloses a planar magnetic-control sputtering target improving utilization efficiency. The planar magnetic-control sputtering target is characterized by comprising a target magnetron jacket; the bottom surface of the target magnetron jacket is connected with a cover plate; cooling water is filled between the cover plate and the target magnetron jacket; a magnetic forehead is arranged in the target magnetron jacket; limber holes are formed on the magnetic forehead which is provided with permanent magnets; target strips are arranged on the target magnetron jacket and a target fixed block is arranged outside the target strips; the target strips are arranged in parallel at intervals and are overlapped; the surfaces of the target strips are flat; target screening cases are arranged outside the target magnetron jacket and the target fixed block; and the magnetic poles of permanent magnets which are arranged in the target magnetron jacket and connected with the magnetic forehead are arranged in parallel in a sequence of NSN or SNS and are perpendicular to the surfaces of the target strips.

Description

technical field [0001] The invention relates to a plane sputtering target used in magnetron sputtering coating, which is suitable for the technical field of physical vapor deposition magnetron sputtering vacuum coating. Background technique [0002] In the vacuum coating industry, sputtering coating technology has the advantages of large-area rapid deposition, good adhesion between the film and the substrate, dense film, less pinholes, good controllability and repeatability of the film layer, so it has developed rapidly in recent years. Wide range of applications. Magnetron sputtering occupies an important position in the coating industry. Due to its remarkable advantages, it is widely used. In magnetron sputtering equipment, in addition to cylindrical targets and moving magnetic field targets, rectangular magnetron sputtering planes are mostly used. Targets, and the targets are mostly precious metal materials, such as Ti, Zr, Au and other metal targets, which are widely us...

Claims

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Application Information

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IPC IPC(8): C23C14/35
Inventor 范家秋
Owner ZHEJIANG TIANCHONG VEHICLE LAMP GROUP
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