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Package structure with exposed inner pins, chip, inverted locking hole, radiating block and external radiator

A technology of packaging structure and heat dissipation block, which is applied in the direction of electric solid-state devices, semiconductor devices, semiconductor/solid-state device components, etc., can solve the problems of limited, small volume and area of ​​metal-based islands, achieve strong heat dissipation capabilities, and avoid rapid Effects of aging or even burnt or burnt out

Inactive Publication Date: 2011-05-25
JCET GROUP CO LTD
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

[0008] Although the metal-based island is exposed, it can provide better heat dissipation than the embedded type, but because the volume and area of ​​the metal-based island are still very small in the package, the ability to provide heat dissipation is still very limited.

Method used

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  • Package structure with exposed inner pins, chip, inverted locking hole, radiating block and external radiator
  • Package structure with exposed inner pins, chip, inverted locking hole, radiating block and external radiator
  • Package structure with exposed inner pins, chip, inverted locking hole, radiating block and external radiator

Examples

Experimental program
Comparison scheme
Effect test

Embodiment 1

[0025] see Figure 5 , Figure 5 It is a schematic diagram of Embodiment 1 of the packaging structure of the heat dissipation block externally connected to the heat sink with the inner pin exposed and the flip-chip locking hole of the present invention. Depend on Figure 5 It can be seen that the packaging structure of the heat sink externally connected to the heat sink with the inner pin exposed from the chip flip-chip locking hole includes the metal inner pin 4 carried by the chip 3, the metal inner pin 4 below the chip, and the metal wire for signal interconnection from the chip to the metal inner pin. The bump 10, the conductive or non-conductive thermally conductive adhesive material I2 between the chip and the metal inner pin and the plastic package 8, the metal inner pin 4 is exposed from the plastic package 8, and a heat dissipation block 7 is arranged above the chip 3, The heat dissipation block 7 has a locking hole 7.1, and a conductive or non-conductive thermally ...

Embodiment 2

[0030] Embodiment 2 differs from Embodiment 1 only in that: the radiator 11 is a heat dissipation cap, such as Figure 6 .

Embodiment 3

[0032] Embodiment 3 differs from Embodiment 1 only in that: the heat sink 11 is a cooling plate, such as Figure 7 .

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PUM

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Abstract

The invention relates to a package structure with exposed inner pins, a chip, an inverted locking hole, a radiating block and an external radiator. The package structure comprises the chip (3), the metal inner pins (4), metal convex blocks (10), conductive or non-conductive heat conducting bonding substances I (2) between the chip and the metal inner pins and plastic package bodies (8), wherein the metal inner pins (4) are exposed out of the plastic package bodies (8). The package structure is characterized in that the radiating block (7) is arranged above the chip (3) and is provided with the locking hole (7.1); a conductive or non-conductive heat conducting bonding substance II (6) is embedded between the radiating block (7) and the chip (3); and the radiator (11) is arranged above the radiating block (7) and is fixedly connected with the radiating block (7) by a screw (12) via the locking hole (7.1). The package structure has strong capability of providing the radiating function and ensures the heat of the chip to be rapidly conducted outside the package bodies.

Description

technical field [0001] The invention relates to a packaging structure and a packaging method for a heat dissipation block externally connected to a heat sink with inner legs exposed to a chip flip-chip locking hole. It belongs to the technical field of semiconductor packaging. Background technique [0002] The traditional heat dissipation method of chip packaging mainly uses the metal base island under the chip as a heat dissipation tool or way, and the heat dissipation conduction of this traditional packaging method has the following shortcomings: [0003] 1. The metal base island is too small [0004] In the traditional packaging form, in order to pursue the reliability and safety of the package, almost all metal-based islands are embedded in the package, and in the limited package, the metal-based island and signal and power conduction must be embedded at the same time. Metal inner feet (such as figure 1 and figure 2 As shown), so the effective area and volume of the...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): H01L23/36H01L23/42H01L23/367
CPCH01L2224/16245H01L2224/32245H01L2224/48247H01L2224/49171H01L2224/73204H01L2224/73253H01L2224/73265H01L2924/181H01L2924/00012H01L2924/00
Inventor 王新潮梁志忠林煜斌
Owner JCET GROUP CO LTD