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Epoxy resin composition

A technology of epoxy resin and epoxy compound, which is applied in the direction of epoxy resin adhesive, modified epoxy resin adhesive, non-polymer organic compound adhesive, etc. In order to solve problems such as poor ejection performance, low initial viscosity and good ejection performance can be achieved

Inactive Publication Date: 2013-10-09
THREEBOND FINE CHEM CO LTD
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

If thixotropy is imparted to suppress fluidity, the viscosity will increase and the ejection performance will deteriorate, making it difficult to apply a small amount

Method used

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  • Epoxy resin composition
  • Epoxy resin composition
  • Epoxy resin composition

Examples

Experimental program
Comparison scheme
Effect test

Embodiment 1～12

[0048] In order to prepare the epoxy resin composition, the following components were prepared.

[0049] (A) Component Epoxy compound

[0050] Liquid epoxy resin mixture of bisphenol A type and bisphenol F type: "Epiclon EXA-835LV (manufactured by Dainippon Ink Chemical Industry Co., Ltd.)"

[0051] (B) Component Partially acrylated epoxy compound

[0052] ● Partially Acrylated Epoxy Compound 1

[0053] ● Partially acrylated epoxy compound 2

[0054] (C) Component (meth)acryloyl compound

[0055] Epoxy-modified acrylic compound: "Epoxy Ester 3002A (manufactured by Kyoeisha Chemical Co., Ltd.)"

[0056] (D) Component Amine curing agent

[0057] Epoxy addition curing agent: "Fujicure FXR-1000 (manufactured by Fuji Chemical Industry Co., Ltd.)"

[0058] Epoxy addition curing agent: "Amicure PN-23 (manufactured by Ajinomoto Fine Techno Co., Ltd.)"

[0059] (E) Component Photoinitiator

[0060] 1-Hydroxy-cyclohexyl-phenyl ketone "IRGACURE 184 (manufactured by Ciba Specialty...

Embodiment 1

[0111] In Examples 1 to 12, the viscosities were 10 to 51 Pa·s, and the TI values ​​were very low, and the ejection properties were good. In addition, fluidity during heating was not observed, indicating that the discharge shape was maintained. On the other hand, in Comparative Examples 2 and 3, although thixotropy was imparted by the addition of the filler, the resin composition spread when heated, so it was not suitable for micro-amount coating. In addition, according to the comparison between Examples 1-12 and Comparative Examples 1-8, it is necessary to add both (B) component and (C) component, and for the addition amount, (B) component needs to be added at least 5 mass parts, (C) Components need to be added at least 1 part by mass. As for the amount of outgassing which is important for the HDD adhesive, it can be seen from Comparative Examples 7 and 8 that when the component (E) is added in excess, the total amount of outgassing tends to increase. In addition, when Exam...

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Abstract

Disclosed is an epoxy resin composition having good ejectability, which loses fluidity when heated even though the composition has not been cured by energy ray irradiation, and maintains the resin shape right after ejection still after the heat curing.  The epoxy resin composition contains the following members as essential components. Component (A): an epoxy compound Component (B): an epoxy compound into which a (meth)acrylic group is partially introduced Component (C): a (meth)acrylic compound Component (D): an amine curing agent Component (E): a photoinitiator

Description

technical field [0001] The present invention relates to an epoxy resin composition, and particularly relates to an epoxy resin composition excellent in dischargeability which can maintain the resin shape immediately after discharge during heat curing and thereafter. Background technique [0002] Epoxy resin compositions are used in the field of electronic parts and other various fields. Especially in the field of electronic components such as hard disk drives (hereinafter abbreviated as HDD), there is a clear trend of miniaturization. Here, an HDD will be described as an example. Along with miniaturization, screwing with parts such as screws and threads, or physical joining (mechanical joining) with riveting or the like has become difficult in the assembly process. In order to miniaturize parts, it is necessary to increase the precision of processing, but there are problems such as difficulty in stable production of parts and increase in unit price of parts. On the other h...

Claims

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Application Information

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Patent Type & Authority Patents(China)
IPC IPC(8): C08G59/17C08F299/00C09J4/02C09J11/06C09J163/00
CPCC08L63/10C08G59/50C09J163/10C08L63/00C08G59/1461C09J163/00C08L2666/22
Inventor 安乐聪彦井上学
Owner THREEBOND FINE CHEM CO LTD
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