Cooling system for semiconductor manufacturing and testing processes
A cooling system, testing process technology, used in semiconductor/solid state device manufacturing, refrigerators, refrigeration components, etc., to solve problems such as damage, semiconductor manufacturing and test component contamination, dripping, etc.
Active Publication Date: 2011-06-01
ADVANCED SEMICON ENG INC
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Problems solved by technology
[0005] However, because of the temperature difference between the air cooling pipe of the vortex tube and the ambient temperature, water vapor is easy to condense around the air cooling pipe, and the condensed water vapor is easy to drop from the air cooling pipe of the vortex tube to the air cooling pipe. on the components to be manufactured or tested, thus easily causing the failure of the components to be tested or manufactured
Generally, the vortex tube is usually wrapped with heat-insulating material on its periphery, but moisture condensation still easily occurs on the wrapped heat-insulating material
Therefore, it is easy to cause contamination and damage to the semiconductor manufacturing and testing components
Method used
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[0020] refer to figure 1 , which shows a schematic diagram of using the vortex unit 1 as a cooling system in the present invention. The vortex tube 2 receives compressed air 3 from a compressor 12 or the central compressed air system of the manufacturing plant and divides it into a hot air stream 4 and a cold air stream 5 . The cylindrical vortex generator 6 in the vortex tube 2 will generate the first swirling airflow, which is sent to the tail end of the vortex tube along the wall of the vortex tube, and the circumference of the first swirling airflow part The laminar airflow 7 passes through the control valve 15 and will be discharged in the form of hot air, and the rest of the first swirling airflow is returned from the central pipeline to form the central laminar airflow 8. The central laminar airflow 8 of the first swirling airflow Flowing at a reverse and slower velocity relative to the laminar airflow 7 , wherein heat in the central laminar airflow 8 is transferred to...
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A cooling system for providing a desired environment for a semiconductor manufacturing and / or testing processes includes a vortex unit and a semiconductor processing device suitable for performing a semiconductor processing function. The vortex unit includes an air inlet for receiving compressed air, a first air exhaust for outputting an air stream having a temperature greater than the received compressed air, and a second air exhaust for outputting an air stream having a temperature lower than the received compressed air, and a dry air tube enclosing the second air exhaust and connecting to the air compressor unit and the vortex unit. Since the dry air continuously flows surrounding the cold air tube, no water will be condensed around the cold air tube. Accordingly, no pollution and damages by the condensed water will happen to the manufactured or tested products.
Description
technical field [0001] The invention relates to a cooling system, especially an eddy current cooling system suitable for semiconductor manufacturing or testing systems, and the system is used to provide ambient temperature suitable for semiconductor manufacturing and testing. Background technique [0002] Manufacturing and testing of semiconductor components is a labor-intensive work, and because of the complexity of manufacturing, high failure rates may occur while manufacturing components. Therefore, the semiconductor components must be extensively tested under set parameters to ensure proper operation. In addition, semiconductor component testing requires not only testing the performance of the semiconductor, but also testing how that performance operates at different expected temperatures. [0003] Semiconductor devices may operate in a very wide range of temperature regimes, from extremely high temperatures to low temperatures, and any desired temperature environment i...
Claims
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Login to View More IPC IPC(8): F25B9/04F25B49/02H01L21/00
CPCH01L21/67109F25B9/04
Inventor 张修明庄庆文孔祥汉
Owner ADVANCED SEMICON ENG INC