Manufacturing method of ceramic spraying part

A manufacturing method and component technology, which is applied in the field of manufacturing ceramic spraying components, can solve problems such as health hazards for operators, toxicity and flammability, environmental pollution, etc., and achieve the effect of eliminating adverse effects and avoiding pollution

Active Publication Date: 2013-02-06
BEIJING NAURA MICROELECTRONICS EQUIP CO LTD
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  • Abstract
  • Description
  • Claims
  • Application Information

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Problems solved by technology

Organic solvents such as acetone and ethanol used in this wet method for removing organic matter are toxic and flammable. Strong acids such as sulfuric acid and nitric acid are usually highly corrosive, and the discharge of waste liquid will pollute the environment and affect the operation. There are also potential hazards to the health of personnel

Method used

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  • Manufacturing method of ceramic spraying part
  • Manufacturing method of ceramic spraying part
  • Manufacturing method of ceramic spraying part

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Embodiment Construction

[0023] The present invention aims to provide a method for manufacturing ceramic sprayed parts, which can effectively remove organic matter on the surface of the ceramic layer, so that the surface of the ceramic layer can obtain sufficient hydrophobicity during hydration treatment, and at the same time avoid pollution to the environment.

[0024] The present invention will be described in detail below in conjunction with the accompanying drawings and embodiments.

[0025] Such as figure 1 Shown, ceramic spraying part manufacturing method of the present invention comprises steps:

[0026] S10, processing the surface of the substrate to form a rough surface;

[0027] The surface of the substrate is sandblasted with particles such as corundum and stainless steel to form an uneven surface on the surface of the substrate. Even if the surface of the substrate has a certain roughness, the roughness is preferably Ra10-20 μm. Forming an uneven surface with a roughness of Ra10-20μm on ...

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Abstract

The invention discloses a manufacturing method of a ceramic spraying part, relating to the field of the manufacturing of ceramic spraying parts, and aiming at achieving the effects of effectively removing organic matters on the surface of a ceramic layer to ensure that the surface of the ceramic layer can obtain sufficient hydrophobicity when being subjected to hydration treatment, and avoiding environmental pollution. The manufacturing method of the ceramic spraying part comprises the steps of: forming a scraggy surface on the surface of a substrate; forming a ceramic layer on the scraggy surface; cleaning the organic matters on the surface of the ceramic layer with a drying method; and hydrating the ceramic layer. The manufacturing method is suitable for treating the organic matters and other blots on the surface of the ceramic layer of the ceramic spraying part.

Description

technical field [0001] The invention relates to the field of semiconductor processing, in particular to a method for manufacturing a ceramic sprayed component. Background technique [0002] In the process of manufacturing semiconductor devices, it is usually necessary to use plasma energy of highly corrosive halogen gas to etch the surface of silicon wafers. In such a harsh working environment, the inner surface of the plasma processing chamber and other components (such as electrostatic chuck, focus ring, etc.) The introduction of defects such as particles or metal contamination on the surface further affects the functionality of semiconductor devices. [0003] In order to overcome the above problems, it is usually necessary to coat a layer of special material on the inner surface of these parts to improve its corrosion resistance, preferably diyttrium trioxide (Y 2 o 3 ) ceramic coating. [0004] Due to the high reactivity of ceramics with moisture in the air, when the...

Claims

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Application Information

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Patent Type & Authority Patents(China)
IPC IPC(8): H01L21/00
Inventor 康明阳
Owner BEIJING NAURA MICROELECTRONICS EQUIP CO LTD
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