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Adhesive encapsulating composition and electronic devices made therewith

A technology for electronic devices and adhesives, applied in the direction of adhesive types, electric solid devices, ester copolymer adhesives, etc., which can solve the problems of sealing performance, unsuitable moisture resistance, deterioration of device performance characteristics, and fracture.

Active Publication Date: 2011-06-01
3M INNOVATIVE PROPERTIES CO
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

However, many polymer materials are not suitable for the above applications due to their sealing properties, moisture resistance, moisture barrier properties, etc.
If a thermosetting polymer material is used, heat is used to cure the material, which can lead to degradation of the organic light-emitting layer and / or charge transport layer, or the light-emitting characteristics of the device can be degraded due to crystallization
If photocurable polymer materials are used, UV radiation is typically used to cure the material, which can lead to degradation of the organic emissive layer and / or charge transport layer
After the polymer material is cured, it can break due to shock, bending or vibration while using the device, which also leads to degraded performance characteristics of the device

Method used

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  • Adhesive encapsulating composition and electronic devices made therewith
  • Adhesive encapsulating composition and electronic devices made therewith
  • Adhesive encapsulating composition and electronic devices made therewith

Examples

Experimental program
Comparison scheme
Effect test

example

[0107] Test Methods

[0108] water vapor transmission rate

[0109] Each sample was prepared by coating and curing the composition on siliconized PET as described in Example 1; and the moisture permeability of each cured adhesive layer was measured by the cup method described in JIS Z0208. The samples were placed in an oven at 60°C and 90% relative humidity for 24 hours. Each sample was measured twice, and the average value of the measurement results is shown in Table 3.

[0110] visible light transmittance

[0111] Each sample was prepared by coating and curing the composition on siliconized PET as described in Example 1; and the transmittance was measured in the range of 400 nm to 800 nm using a spectrophotometer U-4100 manufactured by Hitachi. The results are shown in Table 3.

[0112] dynamic viscoelasticity

[0113]The dynamic viscoelasticity was measured with an ARES rheometer (manufactured by Rheometric Scientific Inc.) in a shear mode at a frequency of 1.0...

example 1

[0120] The following were dissolved in heptane to obtain a 45% by weight solution: 30 g PIB1 , 50 g HCR1 , 20 g Monomer 1 , 5 g filler, 0.5 g Initiator 1 and 0.5 g Coupling Agent 1 . This solution was coated on a siliconized PET film (Teijin-DuPont Co., Ltd. A31 38 μm) using a doctor blade coater. Next, the PET film was dried at 90° C. for 30 minutes, and then laminated on a siliconized PET film (Teijin-DuPont Co., Ltd. A71 38 μm). The laminate was irradiated with ultraviolet rays for 1 minute (F300S (H-valve) produced by Fusion Co., Ltd., 100 mJ x 20 times), and then placed in an oven to be cured at 90° C. for 60 minutes. The thickness of the obtained adhesive layer was 100 μm.

example 2-9

[0122] Examples 2-9 were prepared as described in Example 1 except that the ingredients shown in Table 2 were used.

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Abstract

Adhesive encapsulating compositions for use in electronic devices such as organic electroluminescent devices, touch screens, photovoltaic devices, and thin film transistors are disclosed herein. The adhesive encapsulating compositions include pressure sensitive adhesives comprising one or more polyisobutylene resins, in combination with optional multifunctional (meth)acrylate monomers and / or optional tackifiers.

Description

technical field [0001] The present invention discloses an encapsulation adhesive composition for use in electronic devices. More specifically, the present invention discloses pressure sensitive adhesive compositions comprising polyisobutylene for use in electronic devices such as organic electroluminescent devices, touch screens, photovoltaic devices and thin film transistors. Background technique [0002] An organic electroluminescent device includes an organic layer (hereinafter sometimes referred to as a "light emitting unit") formed by disposing an organic charge transport layer and an organic light emitting layer between an anode and a cathode. Electroluminescent devices typically provide high intensity light emission when driven by direct current and low voltage. Electroluminescent devices have all their components formed from solid materials and have the potential to be used as flexible displays. [0003] The performance of some electroluminescent devices degrades o...

Claims

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Application Information

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IPC IPC(8): C09J123/20C09J133/06H01L51/54H01L23/02
CPCC08L2205/02C08L23/22C09J123/22H01L51/5237Y10T428/2891Y10T428/31935H10K59/8722C08L2666/02H10K50/8426
Inventor 藤田淳小堀奈未维韦卡·巴拉蒂弗雷德·B·麦考密克塞雷娜·L·莫伦豪尔
Owner 3M INNOVATIVE PROPERTIES CO
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