Bonded glass cutting method, package manufacturing method and package

Abstract

To provide a bonded glass cutting method whereby it is possible to suppress an occurrence of a crush or chipping when bonded glass is cut, and cut the bonded glass into pieces of a predetermined size, a package manufacturing method, a package, a piezoelectric vibrator, an oscillator, an electronic device, and an atomic timepiece. A bonded glass cutting method includes a scribing step, which irradiates a lid substrate wafer with a laser beam with a wavelength absorbed by a wafer bonded body along outlines, thus forming scribe lines on the lid substrate wafer, and a breaking step which, by cutting the wafer bonded body by applying a fracture stress to the scribe lines, dices the wafer bonded body into a plurality of piezoelectric vibrators, wherein a cutting step is carried out in a condition in which the wafer bonded body is placed on silicon rubber, and an outside end face of the lid substrate wafer is caused to face the silicon rubber.

Description

technical field [0001] The present invention relates to a method of cutting bonding glass, a method of manufacturing a package, a package, a piezoelectric vibrator, an oscillator, electronic equipment, and a radio clock. Background technique [0002] In recent years, piezoelectric vibrators (packages) using crystals or the like as time sources, timing sources such as control signals, reference signal sources, and the like have been used in mobile phones and portable information terminal devices. As such a piezoelectric vibrator, various piezoelectric vibrators are known, and as one of them, a surface mount (SMD) type piezoelectric vibrator is known. As such a piezoelectric vibrator, there are, for example: a base substrate and a lid substrate bonded to each other; a cavity formed between the two substrates; and a piezoelectric vibrating piece (electronic component) housed in an airtight state in the cavity. ). [0003] Next, a method of manufacturing the above-mentioned pi...

AI Technical Summary

Problems solved by technology

[0012] For this reason, there are problems in that in the manufacture of minute electronic components such as piezoelectric vibrators, it is difficult to cut on a metal table, and the number of good products that can be taken out from one wafer bonded body is reduced, resulting in a low yield.

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