[0032] The present invention provides a chip cleaning machine and cleaning process used in the semiconductor packaging process. The cleaning machine includes a control panel, a cleaning work area, and a drying area. The control panel is located on the upper part of the front of the machine for realizing Control of the cleaning process; the cleaning operation area is located in the middle of the front of the machine and is in the shape of a hollow tank. The operation area includes more than one cleaning tank, and the cleaning machine is equipped with an ultrasonic generator corresponding to each cleaning tank to use ultrasonic waves to clean each The packaged semiconductor chip in the groove is cleaned; and the drying area is used to dry the cleaned chip.
[0033] Preferably, a countertop is provided in the working area of the cleaning operation area, and the cleaning tank includes more than one chemical tank and more than one water tank. The chemical tank and the water tank are formed by relatively recessing the countertop, and the chemical tank contains There is a surfactant solution, and the water tank is filled with deionized water. Further, the ultrasonic generating device includes an ultrasonic vibrator installed at the bottom of the tank and an ultrasonic generator installed at the top of the machine. Each chemical tank and water tank is equipped with an ultrasonic generator for controlling the vibration frequency of the ultrasonic vibrator.
[0034] Preferably, a heating plate is installed on the peripheral side wall of the tank body of each cleaning tank, and correspondingly, a temperature sensor probe is installed on the inner side wall of the cleaning tank.
[0035] Preferably, the drying zone includes a heating spin-drying tank located downstream of the cleaning operation zone, and the heating spin-drying tank has a tank formed by the flat surface of the countertop, and a cover is provided above the tank. The side wall is provided with openings for inputting working gas, and the cover has vents. Preferably, the opening is communicated with the working gas pipeline, the working gas pipeline is connected to the gas supply system, and the working gas pipeline is provided with a heating structure, and the inner wall of the heating spin tank is equipped with temperature Sensor induction probe.
[0036] Preferably, the control panel includes a master controller, a plurality of sub-controllers corresponding to each cleaning tank and/or heating spin-drying tank; the master controller is provided with a safety protection device, such as an emergency stop button; the sub-controller A temperature controller and a time controller are provided to control the working temperature and working time of the cleaning tank and/or the heating spin-drying tank; the side of the machine is equipped with a power distribution area, and the control panel is connected by conductive lines Into the side distribution box.
[0037] The cleaning process of the semiconductor chip of the present invention includes: A. Chemical cleaning: putting the chip into a cleaning tank containing a surfactant solution for cleaning; B. Water washing: cleaning the chemically cleaned chip with deionized water; C. Drying: Use gas to dry the chip.
[0038] The specific embodiments of the present invention will be further described in detail below by taking a semiconductor package chip as an example in conjunction with the drawings and specific embodiments.
[0039] Such as Figure 1 to Figure 4 As shown, it is a schematic structural diagram of a specific embodiment of the cleaning machine of the present invention. The main structure of the machine is as follows: the skeleton is welded by a combination of stainless steel square pipes, which has a strong structure; the shell is welded by a combination of polypropylene ; The lower sliding door is made of transparent polyvinyl chloride, which can well isolate the acid gas and protect the operator.
[0040] The cleaning machine in this embodiment has a rectangular parallelepiped structure, the middle part of the machine is a cleaning work area, the cleaning work area is a hollow tank, and the upper end is provided with a pull-plate shutter to close the work when the machine is in a non-working state Zone to protect the machine. The work area has a countertop 52 on which there are four grooves (cleaning tanks). From left to right, they are the first chemical tank 10, the second chemical tank 12, the first water tank 14, and the second water tank 16. The four cleaning tanks are all recessed grooves relative to the surface of the countertop. A heater sheet A2 is installed around the tank body to heat the tank body evenly. A temperature sensor probe A1 is installed on the inner wall of the tank to sense the tank. temperature. In this embodiment, the ultrasonic generating device includes an ultrasonic vibrator A3 installed at the bottom of the tank and an ultrasonic generator installed at the top of the machine. Each chemical tank and water tank is equipped with an ultrasonic generator to control the vibration frequency of the ultrasonic vibrator. When the machine is in use, the frequency is set in advance, the ultrasonic generator switch is always on, and the tank is heated to the set temperature during operation, and then the time controller is activated. At this time, the ultrasonic also starts to work, that is, each tank The ultrasonic switch is controlled by the corresponding time controller. When the set time is up, the time controller will be cleared and the ultrasonic will stop working.
[0041] The control panel 50 is located above the machine and is used to control the operation of the machine. The control method can be manual. Specifically, the control panel of this embodiment is provided with 6 groups of controllers, which are the main controller A and the first controller B in order. , The second controller C, the third controller D, the fourth controller E, the fifth controller F, where: the first controller B to the fifth controller F have temperature control function and time control function respectively, using LED The screen displays the values, and there are buttons at the bottom of the screen, which can be controlled manually, and the heating temperature and working time of the tank can be set according to needs. The main controller A is equipped with safety protection devices, such as an emergency stop button. The emergency stop button is used to stop immediately in an emergency. Press the button and the machine can stop working immediately. The first controller B is used to control the first chemical tank 10, the second controller C is used to control the second chemical tank 12, the third controller D is used to control the first water tank 14, and the fourth controller E is used to control The second water tank 16 and the fifth controller F are used to control the heating and spin drying tank 18. Of course, in order to further ensure the safety of the cleaning machine, the aforementioned master controller can also be equipped with a leakage safety protection device and an over-temperature and overload protection device. As for the specific structure of the leakage safety protection device and the over-temperature and overload protection device, the technology in the field Under the prerequisite of understanding the technical solution, the personnel can implement it in combination with various structures of the prior art, and details are not described here.
[0042] In this embodiment, the liquid adding methods of the four cleaning tanks are all manual liquid adding, and the liquid draining method is to use gravity to drain to the main drain pipe 46 through the respective drain pipes 39, 41, 43, 45, and then through the main drain pipe. The drain pipe 46 drains.
[0043] The heating and spin-drying tank 18 is located beside the second water tank 16. It is a convex tank body with a cover on the top. The cover is made of stainless steel and has a number of vents. The heating spin-drying tank adopts a gas heating method, and an opening A4 is provided on the rear inner side wall for transmitting hot gas, and the front inner side wall is provided with a temperature sensor probe. The opening A4 is connected with a pipeline to connect to the air supply system; it is better to install a heating plate in a certain section of the pipeline, and the heating plate preferably has an electrical socket. When the power is turned on, the solenoid valve automatically opens and starts When the gas is supplied, the heating plate starts heating. When the gas passes through the heating plate, the temperature rises, and the electric energy is converted into heat energy, and enters the heating spin drying tank 18 through the opening A4, so that the temperature in the heating spin drying tank 18 rises.
[0044] In this embodiment, the rear side wall of the cleaning operation area is provided with a cleaning switching tank 13, a bottom ventilation area 32, a top ventilation area 36, and a shelf 34, wherein the bottom ventilation area 32 and the top ventilation area 36 are used for the chemical tank The gas released by the medium solution is discharged in time, preferably in grid-like spacing. A shelf 34 is provided between the bottom ventilation area 32 and the top ventilation area 36 for placing products or articles during operation. The cleaning switch tank 13 is located above the bottom ventilation area 32 and at the lower left of the shelf 34, and is used for cleaning when different tanks are switched. There is a water outlet pipe 25 above it.
[0045] In this embodiment, an exhaust duct 54 is provided on the upper half of the back of the machine. The exhaust duct 54 is used to exhaust air from the bottom ventilation area 32 and the top ventilation area 36 and is connected to the upper ventilation interface 21. There is a distribution box 19 on the side of the machine, such as Figure 4 As shown, it is used for the placement and switching of conductive lines. The lower part of the back of the machine is the liquid pipeline area, and the drainage pipe is installed.
[0046] In addition, in this embodiment, a fluorescent lamp 48 is installed on the top of the work area for work lighting. Nitrogen guns 11 and pure water guns 15 are installed on the left and right sides of the work area respectively for drying and cleaning products when necessary. A storage cabinet 38 is provided at the lower part of the machine, and the storage cabinet 38 has a sliding door for storing materials and articles. The bottom of the machine is also equipped with supporting feet and pulley devices, which have the function of height adjustment and locking.
[0047] In addition, in order to meet the needs of production, ensure that there is sufficient hot water in the tanks 14, 16 at any time, and shorten the heating time. A water heater (not shown in the figure) can be installed to connect the water heater pipeline to the two tanks separately, and control when needed. The valve opens, and hot water flows from the water heater to the sink.
[0048] Based on the above description of the cleaning machine for semiconductor packaging products, those skilled in the art should have a certain understanding of the cleaning process involved in this case. A cleaning process for semiconductor packaging products includes: A. Chemical cleaning: packaging Put the semiconductor chips in a cleaning tank filled with a surfactant solution for ultrasonic cleaning; B, water washing: the chemically cleaned chips are then cleaned with water for ultrasonic cleaning; C, drying: the chips are dried with gas. Since the cleaning process of the semiconductor package product can be combined with the features in the foregoing cleaning machine description, the description will not be repeated here, and the specific process steps will only be described below in conjunction with specific embodiments of the method.
[0049] For this cleaning process, in order to reduce the frequency of solution tank changing and improve production efficiency, it is preferable to use multiple chemical tanks and multiple water tanks to perform multiple chemical cleaning and multiple water washing on the chip. In a specific embodiment of the present invention, two chemical tanks are used to perform ultrasonic chemical cleaning twice on the chip, and two water tanks are used to perform two water washing on the chip. Wherein, the solution in the chemical tank is a surfactant solution, and the water tank is deionized water.
[0050] Preferably, between step A and step B and/or between step B and step C, a cleaning switching step is further included: the chip after cleaning in the previous step is switched and cleaned with deionized water, and then Next step.
[0051] In the specific embodiment of the cleaning process of the present invention, the packaged semiconductor chips are put into the carrier device according to different batch models, and are sequentially put into the following tanks for cleaning and drying:
[0052] 1. The first chemical tank → temperature: 50°~100°, time: 10 minutes to 30 minutes, perform the first ultrasonic chemical cleaning;
[0053] 2. The second chemical tank → temperature: 50°~100°, time: 10 minutes to 30 minutes, perform the second ultrasonic chemical cleaning;
[0054] 3. Cleaning the switching tank → time: 5 minutes to 20 minutes, for switching cleaning;
[0055] 4. The first water tank → temperature: 50°~100°, time: 10 minutes to 30 minutes, perform the first ultrasonic washing;
[0056] 5. The second water tank → temperature: 50°~100°, time: 10 minutes to 30 minutes, perform the second ultrasonic washing;
[0057] 6. Cleaning the switching tank → time: 5 minutes to 20 minutes, for switching cleaning;
[0058] 7. Heating spin drying tank → temperature: 100°~120°, time: 20 minutes to 30 minutes, to dry the chips;
[0059] 8. Blow the product under the ion fan: 20 minutes-30 minutes to remove static electricity.
[0060] In the above process, step 1 and step 2, and step 3 and step 4 are exactly the same. However, two chemical tanks and two water tanks are used to reduce the frequency of solution tank changing and improve production efficiency. The solution in the chemical tank is a surfactant solution, and the water tank is deionized water. After the above process, the glue on the product will be cleaned.
[0061] Although the present invention has been disclosed in specific embodiments, it is not intended to limit the present invention. Anyone skilled in the art may make substitutions of equivalent components without departing from the concept and scope of the present invention, or according to the present invention. The equivalent changes and modifications made to the scope of patent protection shall still fall within the scope of this patent.
