Supercharge Your Innovation With Domain-Expert AI Agents!

Cleaning machine table for semiconductor package products and cleaning process thereof

A technology for semiconductors and washing machines, which is applied in the direction of cleaning methods using liquids, semiconductor/solid-state device manufacturing, cleaning methods and appliances, etc., which can solve the problem of equipment or processes without residual glue, residual glue performance and functional testing. Large impact and other issues, to achieve the effect of convenient product function test, good cleaning effect and fast cleaning speed

Active Publication Date: 2011-06-15
嘉盛半导体(苏州)有限公司
View PDF7 Cites 22 Cited by
  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

[0004] Due to the large size of the current packaged products, the residual glue usually does not have a great impact on its performance and functional testing, so there is no equipment or process that can completely remove the residual glue

Method used

the structure of the environmentally friendly knitted fabric provided by the present invention; figure 2 Flow chart of the yarn wrapping machine for environmentally friendly knitted fabrics and storage devices; image 3 Is the parameter map of the yarn covering machine
View more

Image

Smart Image Click on the blue labels to locate them in the text.
Viewing Examples
Smart Image
  • Cleaning machine table for semiconductor package products and cleaning process thereof
  • Cleaning machine table for semiconductor package products and cleaning process thereof
  • Cleaning machine table for semiconductor package products and cleaning process thereof

Examples

Experimental program
Comparison scheme
Effect test

Embodiment Construction

[0032] The present invention proposes a chip cleaning machine used in the semiconductor packaging process and a cleaning process, wherein the cleaning machine includes a control panel, a cleaning operation area and a drying area, and the control panel is located on the upper part of the front of the machine for realizing Control of the cleaning process; the cleaning operation area is located in the middle of the front of the machine and is in the shape of a hollow tank. The operation area includes more than one cleaning tank, and the cleaning machine is equipped with an ultrasonic generator corresponding to each cleaning tank to use ultrasonic waves to clean each cleaning tank. The encapsulated semiconductor chips in the groove are cleaned; and the drying area is used for drying the cleaned chips.

[0033] Preferably, a table top is provided in the cleaning operation area, and the above-mentioned cleaning tank includes more than one chemical tank and more than one water tank. T...

the structure of the environmentally friendly knitted fabric provided by the present invention; figure 2 Flow chart of the yarn wrapping machine for environmentally friendly knitted fabrics and storage devices; image 3 Is the parameter map of the yarn covering machine
Login to View More

PUM

No PUM Login to View More

Abstract

The invention discloses a cleaning machine table for a semiconductor package products and a cleaning process thereof. The cleaning machine table comprises a control panel, a cleaning operation area and a drying area, wherein the control panel is arranged on the upper part of a front face of the machine table and is used for controlling the cleaning procedure; the cleaning operation area is arranged in the middle of the front face of the machine table, is in a shape of a hollow groove and comprises more than one cleaning slots, and the cleaning machine table is provided with an ultrasonic generation device corresponding to each cleaning slot so that the semiconductor package products in the cleaning slots can be cleaned by the ultrasonic waves; and the drying area is used for drying the cleaned products. The cleaning process comprises the following steps of ultrasonic chemical cleaning, ultrasonic washing in water and drying. After cleaned, the residual glue on the semiconductor package product can be nearly and completely removed so that the product performance is greatly improved and the following product function test is convenient.

Description

technical field [0001] The invention relates to a semiconductor packaging technology, in particular to a cleaning machine and a cleaning process for semiconductor packaging products. Background technique [0002] As we all know, the purpose of semiconductor packaging is to complete the electrical interconnection between the pins of the internal circuit of the bare chip and the signal terminals of the external substrate, and at the same time protect the bare chip from damage by foreign objects, so that it can bear a certain external force and achieve good heat dissipation. With the increasing development of semiconductor technology and the market's demand for miniaturization, the miniaturization of products has become the trend of technology development and the focus of industry competition. QFN (Quad Flat Non-leaded Package, QFN) is a more advanced packaging process in semiconductor packaging in recent years. The packaged products are square, and the pins are also arranged i...

Claims

the structure of the environmentally friendly knitted fabric provided by the present invention; figure 2 Flow chart of the yarn wrapping machine for environmentally friendly knitted fabrics and storage devices; image 3 Is the parameter map of the yarn covering machine
Login to View More

Application Information

Patent Timeline
no application Login to View More
IPC IPC(8): H01L21/00B08B3/12H01L21/02
Inventor 王超李志卫陈武伟
Owner 嘉盛半导体(苏州)有限公司
Features
  • R&D
  • Intellectual Property
  • Life Sciences
  • Materials
  • Tech Scout
Why Patsnap Eureka
  • Unparalleled Data Quality
  • Higher Quality Content
  • 60% Fewer Hallucinations
Social media
Patsnap Eureka Blog
Learn More

Browse by: Latest US Patents, China's latest patents, Technical Efficacy Thesaurus, Application Domain, Technology Topic, Popular Technical Reports.

© 2025 PatSnap. All rights reserved.Legal|Privacy policy|Modern Slavery Act Transparency Statement|Sitemap|About US| Contact US: help@patsnap.com