Nitride light emitting diode having composite double current spreading layer
A technology of light-emitting diodes and current expansion layers, which is applied in circuits, electrical components, semiconductor devices, etc., can solve the problems of high current density, current crowding, and effective improvement of the limited light efficiency level, so as to improve the electrostatic breakdown voltage and avoid Effect of current crowding and improvement of luminous efficiency
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Embodiment 1
[0049] figure 2 It is a schematic cross-sectional view of the structure of a nitride light-emitting diode module (LED module) according to Example 2 of the present invention. The nitride light-emitting diode assembly of this embodiment has a structure in which the following layers are sequentially stacked on the sapphire substrate 100:
[0050] (1) The buffer layer 101 made of gallium nitride (GaN), aluminum nitride (AlN) or gallium aluminum nitride (GaAlN) has a film thickness of 200 angstroms to 500 angstroms.
[0051] (2) The n-type nitride semiconductor layer 102 made of Si-doped GaN has a film thickness of 20000 angstroms to 40000 angstroms.
[0052] (3) The composite double current spreading layer 103 formed by stacking the first current spreading layer and the second current spreading layer sequentially has a film thickness of 1000 angstroms to 20000 angstroms. The first current spreading layer 103a is a distributed insulating layer formed on the n-type nitride semic...
Embodiment 2
[0059] Figure 4 It is a schematic cross-sectional view of the structure of the nitride light-emitting diode module according to the second embodiment of the present invention. Compared with Embodiment 1, this embodiment has a composite double current spreading layer in which a graded silicon-doped n-type layer 103b is added between the first current spreading layer and the second current spreading layer, and its film thickness is 200 angstroms to 5000 angstroms. The graded silicon-doped n-type layer 103b is designed such that the silicon doping concentration is low-doped 1×10 17 cm -3 Gradient to high doping 1×10 19 cm -3 The n-type nitride semiconductor layer is formed by secondary epitaxy, and its purpose is to use the graded silicon-doped n-type nitride semiconductor layer to repair and improve the first current spreading layer of surface defects caused by ion implantation, and then The lattice quality of the nitride semiconductor layer after the secondary epitaxy ...
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