Fracture method of brittle material substrate
A brittle material substrate, substrate technology, applied in the direction of stone processing tools, stone processing equipment, fine working devices, etc., can solve the problems of unusable, broken flat glass, unable to obtain shape, etc., to reduce the processing process, no cutting Residues, the effect of shortening the processing time
Inactive Publication Date: 2016-02-03
MITSUBOSHI DIAMOND IND CO LTD
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[0009] On the other hand, if the scribe line forming the closed curve intersects the auxiliary scribe line, then when the damage of the auxiliary scribe line develops first, abnormal damage occurs at this intersection point, and there is a problem that not only the desired shape cannot be obtained, but also the flat glass Damaged and unusable
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[0039] Hereinafter, an embodiment of the breaking method of the present invention will be described using drawings. figure 1 It is a diagram showing an example of the layout of the scribe lines formed when cutting out multiple round products from a glass substrate. figure 1 (a) is its overall picture, figure 1 (b) is a partial enlarged view. In addition, figure 2 It is a diagram showing an example of a scoring wheel used when forming a scribing line, figure 2 (a) is its front view, figure 2 (b) is a diagram showing the state of use.
[0040] First, the scoring wheel used will be described. The tip of the scoring wheel is like figure 2 As shown in (a), it is preferable to use a grooved scoring wheel SH in which the wheel surface does not easily slide with respect to the substrate surface. By using a grooved scribing wheel, it is easy to form a scribing line for a contour including a closed curve in the substrate, or to form a linear auxiliary scribing line whose start and e...
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The present invention provides a method for breaking the thorns which are less prone to abnormal damage and thorns caused by the phenomenon of cutting residues. In this breaking method, a scribe line for contour including a closed curve constituting the contour of the product to be cut is formed on the surface of the brittle material substrate 10, and an auxiliary scribe line for auxiliary breaking is formed on the outside of the scribe line for contour, and then the breaking is performed The fracture method of the brittle material substrate, and the auxiliary scribe lines 12a to 12d, 13a to 13d are oriented in the tangential direction of the outline scribe lines 11a to 11c, and a distance of 2 mm or less remains between the auxiliary scribe lines and the outline scribe lines. These scribe lines are formed in such a manner as to form a non-scribed area of the substrate, and then a stress is applied to bend the substrate to break it.
Description
Technical field [0001] The invention relates to a fracture method in which a scribing line formed on the surface of the substrate is fractured when a product is cut out from a brittle material substrate. The present invention is used for fracture processing when, for example, an area surrounded by a closed curve such as a circle or an ellipse is cut out from a glass substrate. [0002] In addition, the brittle materials here include ceramics, single crystal silicon, semiconductor wafers, sapphire, etc., in addition to glass substrates. Background technique [0003] Generally, when cutting out a product from a glass substrate or the like, the method of using a scoring wheel (also called a cutter wheel) is widely used. [0004] That is, first, the scribing wheel is pressed and moved along the planned breaking line including the contour line of the product, thereby forming a scribing line (a linear crack that does not penetrate the depth of the substrate). Next, a force to bend the su...
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IPC IPC(8): B28D5/00C03B33/04
CPCB28D1/225C03B33/04C03B33/107B28D5/00
Inventor 川畑孝志阪口良太村上健二
Owner MITSUBOSHI DIAMOND IND CO LTD