Film adhering method and device of wafer
A film sticking device and wafer technology, applied in electrical components, semiconductor/solid-state device manufacturing, circuits, etc., can solve the problems of reducing chip yield, affecting wafer quality, not non-contact film sticking, etc., to reduce damage to crystals. The risk of rounding the front, reducing the risk of re-filming, the effect of high filming efficiency
- Summary
- Abstract
- Description
- Claims
- Application Information
AI Technical Summary
Problems solved by technology
Method used
Image
Examples
Embodiment 1
[0050] Such as figure 1 As shown, the wafer attaching device includes a base 1. Four seat legs (two seat legs 121 and 122 are shown in the figure) are installed on the lower surface of the base 1 to support the base 1. The upper surface 11 of the base 1 is provided with a first groove (not shown in the figure) for receiving the first plate 2.
[0051] Such as figure 1 As shown, the first plate 2 is circular. The upper surface 21 of the first plate 2 is provided with a plurality of first air holes 22, the number of which can be determined according to the diameter of the first plate 2. The number of first air holes 22 in each circle is more than two, which are evenly distributed along the circumferential direction, and the specific number can be determined according to the circumferential length. The first air hole 22 extends from the upper surface of the first platen 2 to the lower surface. The first air holes 22 are in communication with an air compressor (not shown in the fi...
Embodiment 2
[0055] Figure 4 It is a schematic structural diagram of Embodiment 2 of the present invention. Such as Figure 4 As shown, the wafer sticking device includes a base 1, and four seat legs are installed on the lower surface of the base 1 to support the base 1. Figure 4 Only two legs (121, 122) are shown in.
[0056] The upper surface 11 of the base 1 is provided with a first groove (not shown in the figure). The first groove is used to accommodate the first disc 2. The structure and usage of the first tray 2 are the same as those in the first embodiment. The size of the first tray 2 is equivalent to that of a 12-inch wafer. The edge of the 12-inch wafer can be sucked and fixed on the first tray 2 through the second air hole 23. The compressed air can be blown between the 12-inch wafer and the first tray 2 through the first air hole 22 to provide support for the 12-inch wafer.
[0057] The upper surface 21 of the first plate 2 is provided with a second groove (not shown in the f...
Embodiment 3
[0069] The difference between this embodiment and the second embodiment is that the first plate 2 and the cylinder are not provided. The second platen 3 is arranged in the first groove of the base 1, and the size of the first groove is adapted to the diameter of the second platen 3. The rest of the structure is the same as the second embodiment.
[0070] This embodiment is only applicable to wafers with one size of film, but either non-contact film or contact film can be used.
PUM
Abstract
Description
Claims
Application Information
- R&D Engineer
- R&D Manager
- IP Professional
- Industry Leading Data Capabilities
- Powerful AI technology
- Patent DNA Extraction
Browse by: Latest US Patents, China's latest patents, Technical Efficacy Thesaurus, Application Domain, Technology Topic, Popular Technical Reports.
© 2024 PatSnap. All rights reserved.Legal|Privacy policy|Modern Slavery Act Transparency Statement|Sitemap|About US| Contact US: help@patsnap.com