Swelling solution for removing through-hole residues of epoxy resin circuit board
An epoxy resin and circuit board technology, which is applied in the field of high Tg (Tg means glass transition temperature), can solve the problems to be further improved, and achieve the effect of good swelling effect and improving adhesion strength.
Active Publication Date: 2012-08-29
溧阳常大技术转移中心有限公司
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Problems solved by technology
Although the swelling solution of the above-mentioned patent can effectively remove the residue in the hole of the high Tg epoxy resin circuit board, the adhesion strength of the copper plating layer needs to be further improved
Method used
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Embodiment 1-8
[0019] The composition of the swelling solution in Examples 1-8 is shown in Table 1, wherein the concentration of the aqueous solution of tetrahydrofuran derivative and hexanediol is marked, and the rest is water. Evaluation was performed using an epoxy resin circuit board with a Tg of 172°C. After the circuit board drills a 150 μm hole, it is immersed in the swelling solution with a temperature of 60° C. for 5 minutes; after washing, it is immersed in an alkaline solution of potassium permanganate at a temperature of 60° C. (potassium permanganate 55 g / L hydroxide Sodium 35g / L); after washing with water, immerse in an acidic reducing solution at a temperature of 60°C (oxalic acid 30g / L, sulfuric acid 10mL / L), after washing with water, observe the cross-section of the hole with an electron microscope. The observation results of the residue on the hole wall of the circuit board are listed in Table 1. Treated according to the above method, the adhesion strength test results of ...
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Abstract
The invention relates to a swelling solution for removing through-hole residues of an epoxy resin circuit board, in particular to a swelling solution for removing through-hole residues, which is suitable for a high-Tg epoxy resin circuit board (Tg refers to a glass-transition temperature, similarly hereafter; and high Tg indicates that the glass-transition temperature is greater than 150 DEG C, similarly hereafter). The swelling solution is composed of a water solution of a tetrahydrofuran derivate and hexanediol, and the addition amounts of the tetrahydrofuran derivate and the hexanediol arerespectively 100-500g / L and 10-100g / L; and a structural formula of the tetrahydrofuran derivate is shown in the specification, wherein n is selected from 3 to 8. Because the tetrahydrofuran derivate has an effective swelling effect on epoxy resin, the residues in holes of the circuit board can be thoroughly removed after being treated by a potassium permanganate solution; meanwhile, the damage tothe performance of the circuit board treated by the potassium permanganate solution cannot be caused even if a little of swelling solution is brought into the potassium permanganate solution.
Description
technical field [0001] The present invention is applicable to the swelling solution for removal of through-hole residues of epoxy resin material circuit boards with high Tg (Tg means glass transition temperature, the same below; high Tg means the glass transition temperature is greater than 150°C, the same below), specifically, It relates to a technical method for removing residues after the circuit board is drilled, that is, in order to remove the residues in the through holes well, before performing potassium permanganate oxidation treatment, the circuit board is immersed in the swelling solution of the present invention, so that the residue in the hole After the residue is expanded, it can be effectively removed, and at the same time, it can increase the treatment effect of potassium permanganate on the epoxy resin of the hole wall, and enhance the adhesion strength of the copper plating layer in the subsequent electroless plating process. Background technique [0002] F...
Claims
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IPC IPC(8): C08J7/02C08L63/00
Inventor 韩国防王文昌陈智栋石建华
Owner 溧阳常大技术转移中心有限公司