Wiring board with built-in electronic component and method for manufacturing the wiring board
A technology of electronic components and manufacturing methods, which is applied in the fields of printed circuit manufacturing, multilayer circuit manufacturing, semiconductor/solid-state device manufacturing, etc., can solve the problems of circuit board warpage and different thermal expansion rates, and achieve warpage prevention and excellent quality Effect
Inactive Publication Date: 2011-07-20
IBIDEN CO LTD
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- Description
- Claims
- Application Information
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Problems solved by technology
Therefore, in the case where the solder resist is formed over the entire surface of the conductor pattern layer on which the connection terminals are formed, there is a possibility that the wiring board may warp due to the difference in thermal expansion coefficient between the two.
Method used
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[0057] Next, a wiring board with a built-in electronic component and a manufacturing method thereof according to an embodiment of the present invention will be described with reference to the drawings.
[0058] Figure 4F It is a schematic sectional view of wiring board 1 with built-in electronic components of this embodiment. This wiring board 1 with built-in electronic components can be used, for example, as a core substrate or the like of a multilayer printed wiring board.
[0059] The circuit board 1 with built-in electronic components is composed of electronic components 2, insulating material 3, underfill material 4, filling resin 5, conductive patterns 40, 50 in the inner layer, solder resist layer 112, conductive patterns 60, 70 in the outer layer, and connection terminals 80. , The via-hole conductor 90 is formed.
[0060] The electronic component 2 is a flip chip and has a plurality of bumps 20 arranged in an area array type. The bump 20 is, for example, a stud-sh...
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Abstract
A wiring board (1) with a built-in electronic component is provided with a conductor pattern layer (40); a connecting terminal (80), which is arranged on the conductor pattern layer (40) and is electrically connected to a flip-chip mounted electronic component (2); and a solder resist layer (112) formed on the conductor pattern layer (40). The solder resist layer (112) is formed at the periphery of the connecting terminal (80) on the conductor pattern layer (40), and is not formed at least on some other regions on the conductor pattern layer (40). Thus, the connecting terminal (80) is protected, and insulation between the conductors is ensured. Furthermore, since the solder resist layer (112) is not formed entirely on the conductor pattern layer (40), warpage of the substrate can be reduced.
Description
technical field [0001] The present invention relates to a circuit board with a built-in electronic component that accommodates electronic components such as semiconductor elements inside. Background technique [0002] In recent years, the performance and miniaturization of electronic equipment have been advanced, and at the same time, the demand for higher functionality and higher integration of circuit boards installed in electronic equipment has been increasing. [0003] In response to the above situation, various technologies for accommodating (embedding) electronic components such as IC chips in wiring boards have been proposed (for example, the multilayer wiring board disclosed in Patent Document 1). [0004] As disclosed in Patent Document 1, by embedding electronic components in a wiring board, it is possible to increase the functionality and density of a multilayer wiring board. That is, by accommodating electronic components inside, other electronic components and ...
Claims
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IPC IPC(8): H05K3/46
CPCH01L2224/18H01L2224/73203H05K3/205H01L23/3121H01L2924/0105H01L2224/81001H01L2221/68345H01L2224/81193H01L23/49827H01L2924/01004H01L21/56H01L2224/81801H01L2224/16H05K2201/09909H01L24/82H01L2224/82047H01L2924/01029H05K3/4602H01L21/6835H01L21/563H01L21/568H05K1/187H01L2924/014H01L2924/01013H01L2224/32225H01L2224/82039H01L2224/92125H01L24/81H01L2924/01079H01L2224/73204H01L24/18H01L2924/14H01L2924/01005H01L2924/01033H01L2924/01006H01L23/3107H05K3/3452H01L2924/01078H01L2924/01057H01L24/16H01L2224/16225H01L23/5389H01L2224/0554H01L2224/05567H01L2224/05573H01L2224/056H01L2224/16227H01L2224/81005H01L2224/83005H01L2924/00014H01L2924/15313H01L2924/3511Y10T29/49133Y10T29/49144Y10T29/49146Y10T29/49204H01L2924/00H01L2224/05599H01L2224/0555H01L2224/0556
Inventor 古谷俊树古泽刚士
Owner IBIDEN CO LTD
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