Looking for breakthrough ideas for innovation challenges? Try Patsnap Eureka!

Wiring board with built-in electronic component and method for manufacturing the wiring board

A technology of electronic components and manufacturing methods, which is applied in the fields of printed circuit manufacturing, multilayer circuit manufacturing, semiconductor/solid-state device manufacturing, etc., can solve the problems of circuit board warpage and different thermal expansion rates, and achieve warpage prevention and excellent quality Effect

Inactive Publication Date: 2011-07-20
IBIDEN CO LTD
View PDF5 Cites 6 Cited by
  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

Therefore, in the case where the solder resist is formed over the entire surface of the conductor pattern layer on which the connection terminals are formed, there is a possibility that the wiring board may warp due to the difference in thermal expansion coefficient between the two.

Method used

the structure of the environmentally friendly knitted fabric provided by the present invention; figure 2 Flow chart of the yarn wrapping machine for environmentally friendly knitted fabrics and storage devices; image 3 Is the parameter map of the yarn covering machine
View more

Image

Smart Image Click on the blue labels to locate them in the text.
Viewing Examples
Smart Image
  • Wiring board with built-in electronic component and method for manufacturing the wiring board
  • Wiring board with built-in electronic component and method for manufacturing the wiring board
  • Wiring board with built-in electronic component and method for manufacturing the wiring board

Examples

Experimental program
Comparison scheme
Effect test

Embodiment Construction

[0057] Next, a wiring board with a built-in electronic component and a manufacturing method thereof according to an embodiment of the present invention will be described with reference to the drawings.

[0058] Figure 4F It is a schematic sectional view of wiring board 1 with built-in electronic components of this embodiment. This wiring board 1 with built-in electronic components can be used, for example, as a core substrate or the like of a multilayer printed wiring board.

[0059] The circuit board 1 with built-in electronic components is composed of electronic components 2, insulating material 3, underfill material 4, filling resin 5, conductive patterns 40, 50 in the inner layer, solder resist layer 112, conductive patterns 60, 70 in the outer layer, and connection terminals 80. , The via-hole conductor 90 is formed.

[0060] The electronic component 2 is a flip chip and has a plurality of bumps 20 arranged in an area array type. The bump 20 is, for example, a stud-sh...

the structure of the environmentally friendly knitted fabric provided by the present invention; figure 2 Flow chart of the yarn wrapping machine for environmentally friendly knitted fabrics and storage devices; image 3 Is the parameter map of the yarn covering machine
Login to View More

PUM

PropertyMeasurementUnit
particle sizeaaaaaaaaaa
thicknessaaaaaaaaaa
thicknessaaaaaaaaaa
Login to View More

Abstract

A wiring board (1) with a built-in electronic component is provided with a conductor pattern layer (40); a connecting terminal (80), which is arranged on the conductor pattern layer (40) and is electrically connected to a flip-chip mounted electronic component (2); and a solder resist layer (112) formed on the conductor pattern layer (40). The solder resist layer (112) is formed at the periphery of the connecting terminal (80) on the conductor pattern layer (40), and is not formed at least on some other regions on the conductor pattern layer (40). Thus, the connecting terminal (80) is protected, and insulation between the conductors is ensured. Furthermore, since the solder resist layer (112) is not formed entirely on the conductor pattern layer (40), warpage of the substrate can be reduced.

Description

technical field [0001] The present invention relates to a circuit board with a built-in electronic component that accommodates electronic components such as semiconductor elements inside. Background technique [0002] In recent years, the performance and miniaturization of electronic equipment have been advanced, and at the same time, the demand for higher functionality and higher integration of circuit boards installed in electronic equipment has been increasing. [0003] In response to the above situation, various technologies for accommodating (embedding) electronic components such as IC chips in wiring boards have been proposed (for example, the multilayer wiring board disclosed in Patent Document 1). [0004] As disclosed in Patent Document 1, by embedding electronic components in a wiring board, it is possible to increase the functionality and density of a multilayer wiring board. That is, by accommodating electronic components inside, other electronic components and ...

Claims

the structure of the environmentally friendly knitted fabric provided by the present invention; figure 2 Flow chart of the yarn wrapping machine for environmentally friendly knitted fabrics and storage devices; image 3 Is the parameter map of the yarn covering machine
Login to View More

Application Information

Patent Timeline
no application Login to View More
Patent Type & Authority Applications(China)
IPC IPC(8): H05K3/46
CPCH01L2224/18H01L2224/73203H05K3/205H01L23/3121H01L2924/0105H01L2224/81001H01L2221/68345H01L2224/81193H01L23/49827H01L2924/01004H01L21/56H01L2224/81801H01L2224/16H05K2201/09909H01L24/82H01L2224/82047H01L2924/01029H05K3/4602H01L21/6835H01L21/563H01L21/568H05K1/187H01L2924/014H01L2924/01013H01L2224/32225H01L2224/82039H01L2224/92125H01L24/81H01L2924/01079H01L2224/73204H01L24/18H01L2924/14H01L2924/01005H01L2924/01033H01L2924/01006H01L23/3107H05K3/3452H01L2924/01078H01L2924/01057H01L24/16H01L2224/16225H01L23/5389H01L2224/0554H01L2224/05567H01L2224/05573H01L2224/056H01L2224/16227H01L2224/81005H01L2224/83005H01L2924/00014H01L2924/15313H01L2924/3511Y10T29/49133Y10T29/49144Y10T29/49146Y10T29/49204H01L2924/00H01L2224/05599H01L2224/0555H01L2224/0556
Inventor 古谷俊树古泽刚士
Owner IBIDEN CO LTD
Who we serve
  • R&D Engineer
  • R&D Manager
  • IP Professional
Why Patsnap Eureka
  • Industry Leading Data Capabilities
  • Powerful AI technology
  • Patent DNA Extraction
Social media
Patsnap Eureka Blog
Learn More
PatSnap group products

Browse by: Latest US Patents, China's latest patents, Technical Efficacy Thesaurus, Application Domain, Technology Topic, Popular Technical Reports.

© 2024 PatSnap. All rights reserved.Legal|Privacy policy|Modern Slavery Act Transparency Statement|Sitemap|About US| Contact US: help@patsnap.com