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Single-wafer drying device and method

A drying device and drying method technology, applied in the direction of drying solid materials, heating to dry solid materials, drying, etc., can solve the problems of no recovery of process liquid, easy formation of water marks, waste of raw materials, etc., to avoid product defects, The effect of saving raw materials

Active Publication Date: 2012-09-05
BEIJING NAURA MICROELECTRONICS EQUIP CO LTD
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

However, in these existing drying methods, water marks are easily formed during the drying process in single-wafer cleaning, resulting in product defects, and because the process liquid is not recovered in the existing cleaning process, resulting in waste of raw materials

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  • Single-wafer drying device and method
  • Single-wafer drying device and method
  • Single-wafer drying device and method

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Embodiment Construction

[0022] The specific implementation manners of the present invention will be further described in detail below in conjunction with the accompanying drawings and embodiments. The following examples are used to illustrate the present invention, but are not intended to limit the scope of the present invention.

[0023] figure 1 It is a schematic structural diagram of a single wafer drying device according to an embodiment of the present invention, including: a process chamber 7, a wafer support 20 arranged in the process chamber 7, a process liquid input pipeline 11, deionized water The input pipeline 12, the waste liquid recovery pipeline 17 arranged at the bottom of the process chamber 7, the ends of the process liquid input pipeline 11 and the deionized water input pipeline 12 extending into the process chamber 7 are respectively connected to the crystal The circular supports 20 are opposite to each other, and from aligning the wafers to be placed on the wafer supports 20, the...

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Abstract

The invention discloses a single-wafer drying device comprising a process cavity (7), a wafer support (20), a gas inlet pipe (6) and a first nitrogen input pipeline (3), wherein the wafer support (20) is arranged in the process cavity (7); one end of the gas inlet pipe (6) is connected with the outer wall of the process cavity (7); the first nitrogen input pipeline (3) is connected with the gas inlet pipe (6); the other end of the gas inlet pipe (6) is used for connecting with a steam cavity (2) loading isopropyl ketone; the steam cavity (2) is internally provided with a heating device (1); and an outlet of the steam cavity (2) and the first nitrogen input pipeline (3) are both internally provided with gas mass flow meters. The invention overcomes the product defects caused by water marksgenerated in the drying process through the matching of all the parts.

Description

technical field [0001] The invention relates to the technical field of wafer drying technology, in particular to a single wafer drying device and method. Background technique [0002] In the cleaning process of integrated circuit wafers, drying the upper surface of the wafer is a very important part. There are many drying methods for the upper surface of the wafer, and the drying methods for bath cleaning and single-wafer cleaning are different. Current drying methods for single wafer cleaning include spin dry, iso-Propyl alcohol (IPA) surface tension gradient method and hot nitrogen gas method. However, in these existing drying methods, water marks are easily formed during the drying process in single wafer cleaning, thereby causing product defects, and because the process liquid is not recovered in the existing cleaning process, raw materials are wasted. Contents of the invention [0003] (1) Technical problems to be solved [0004] The technical problem to be solved ...

Claims

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Application Information

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Patent Type & Authority Patents(China)
IPC IPC(8): H01L21/00H01L21/02F26B3/02
Inventor 张晓红吴仪赵宏宇王锐廷
Owner BEIJING NAURA MICROELECTRONICS EQUIP CO LTD