Method of dispensing fluorescent glue on LED (light-emitting diode) based on COB (Chip On Board) technology

Abstract

The invention belongs to the technical field of LED (light-emitting diode) package and particularly relates to a method of dispensing fluorescent glue on an LED based on COB (Chip On Board) technology. The method uses LED fluorescent powder, silica gel and a die bonded LED chip as materials and a needle cylinder glue dispensing machine as equipment, and comprises the steps of firstly blending the LED fluorescent powder and the silica gel to form fluorescent glue according to a certain proportion; then pumping bubbles in the fluorescent glue and loading in a needle cylinder; and finally dispensing the fluorescent glue on the LED surface directly through the needle cylinder glue dispensing machine to form a layer of convex lens shaped fluorescent glue on the surface of the chip through the surface tension of the fluorescent glue and the limitation of the boundary of the chip. The dispending method is simple and convenient, the color temperature and color rendering index can be conveniently adjusted only by adjusting the proportion of the fluorescent power and dispensing amount; the method is not limited by the package form, the shape of a PCB (printed circuit board) and the structure, and only depends on the shape of the chip; the material is saved, and the use amount of the fluorescent glue is greatly reduced compared with the traditional method of directly filling the fluorescent glue in a reflecting cup, therefore, the cost is reduced; and the color temperature uniformity of white light emitted by the module packaged by the method is good at each angle.

Description

technical field [0001] The invention belongs to the technical field of LED packaging, and in particular relates to a method for dispensing fluorescent glue for LEDs based on COB technology. Background technique [0002] The LED lighting products on the market now almost completely use the traditional LED packaging process, that is, the LED chip 1 and the bracket 3 are first packaged into a device, and then soldered on the PCB substrate 4 to realize circuit connection, and finally the PCB substrate is covered with silica gel and lamps 5 The connection enables the transfer of heat. For LED packages, especially high-power LEDs, heat dissipation and light extraction have become two major problems, and heat dissipation is the most serious problem. High working junction temperature will greatly affect the light efficiency, light color, life and light decay of the whole lamp. To solve this problem, we propose a LED packaging method based on COB technology for lighting application...

AI Technical Summary

Problems solved by technology

[0005] The present invention is a method of dispensing fluorescent glue for LEDs based on COB technology, which solves the problems of poor color temperature uniformity at different angles in the traditional fluorescent glue dispensing process and cannot be used for PCB substrates without reflective cups.

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