Ultraviolet dual-curing conductive adhesive and preparation method thereof

A dual-curing, UV technology, applied in the direction of conductive adhesives, adhesives, adhesive types, etc., to improve performance, solve unstable performance, and simple operation

Active Publication Date: 2014-09-17
YONGZHOU FUXING ELECTRONICS SCI & TECH
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

[0011] The object of the present invention is to provide a UV dual-curing adhesive with conductive function and its preparation method. The same resin molecule in the adhesive composition has both UV-curable groups (C=C double bonds) and There are heat-curing groups (epoxy groups), which can be cured by UV-heat mixing. This kind of adhesive can be quickly cured under ultraviolet light to achieve a certain bonding strength, and can still be used after the ultraviolet light is withdrawn. Continue thermal curing, further improve the bonding strength, realize deep curing, and solve some defects existing in the existing single UV curing adhesive

Method used

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Examples

Experimental program
Comparison scheme
Effect test

Embodiment 1

[0037] The components and mass percentages of the conductive adhesive of the present invention are as follows:

[0038]Polyurethane modified bisphenol A epoxy acrylate monoester 33

[0039] Glycidyl acrylate 8

[0040] Dipropylene glycol diacrylate 6

[0041] Triethylene glycol diacrylate 6

[0042] Silver Powder 36

[0043] γ-Aminopropyltriethoxysilane 4

[0044] 2-Hydroxy-2-methyl-1-phenyl-1-propanone 2

[0045] 2,4,6-Trimethylbenzoyl-diphenylphosphine oxide 1

[0046] Aliphatic Modified Amines 4

[0047] The preparation method of the conductive adhesive is: first stir and mix polyurethane modified bisphenol A epoxy acrylate monoester, glycidyl acrylate, dipropylene glycol diacrylate and triethylene glycol diacrylate, and then add γ-Aminopropyltriethoxysilane and silver powder, grind and disperse evenly with a high-speed disperser, add photoinitiator 2-hydroxy-2-methyl-1-phenyl-1-propanone, 2,4,6- The trimethylbenzoyl-diphenylphosphine oxide and the heat curing agent...

Embodiment 2

[0050] The components and mass percentages of the conductive adhesive of the present invention are as follows:

[0051] Polyurethane modified polyol toughened epoxy acrylate monoester 25

[0052] Hydroxyethyl Acrylate 5

[0053] 1,6-Hexanediol diacrylate 10

[0054] Trimethylolpropane Triacrylate 5

[0055] Copper Silver Plating Powder 40

[0056] γ-Methacryloxypropyltrimethoxysilane 5

[0057] 1-Hydroxycyclohexyl phenyl ketone 3

[0058] 2,4,6-Trimethylbenzoyl-diphenylphosphine oxide 2

[0059] Aromatic amine 5

[0060] The preparation method of the adhesive is the same as in Example 1.

[0061] The adhesive is coated on the glass substrate, and its performance is tested after ultraviolet-heat dual curing. The bonding strength of the conductive adhesive of the present invention is 1.9MPa (compressive shear strength), and it has good alcohol resistance and water resistance. , the volume resistivity is 8.2×10 -2 Ω·cm.

Embodiment 3

[0063] The components and mass percentages of the conductive adhesive of the present invention are as follows:

[0064] Polyurethane modified fatty acid toughened epoxy acrylate monoester 40

[0065] Butyl acrylate 6

[0066] Neopentyl glycol diacrylate 9

[0067] Pentaerythritol triacrylate 3

[0068] Copper powder 30

[0069] γ-Aminoethylaminopropyltrimethoxysilane 4

[0070] 2,4,6-Trimethylbenzophenone 2

[0071] 2,4,6-Trimethylbenzoyl-diphenylphosphine oxide 2

[0072] Dicyandiamide 4

[0073] The preparation method of the adhesive is the same as in Example 1.

[0074] The adhesive is coated on the glass substrate, and its performance is tested after ultraviolet-heat dual curing. It is tested that the bonding strength of the conductive adhesive of the present invention is 2.5MPa (compressive shear strength), and it has good alcohol resistance and water resistance. , the volume resistivity is 3.3×10 -1 Ω·cm.

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Abstract

The invention discloses an ultraviolet-heat dual-curing adhesive composition and a preparation method thereof. The ultraviolet dual-curing adhesive composition comprises the following components in percentage by mass: 20-50% of polyurethane modified epoxy monoacrylate, 10-25% of reactive diluent, 5-40% of conductive filler, 1-5% of silane coupling agent, 1-5% of photoinitiator and 1-5% of heat curing agent. The ultraviolet-heat dual-curing adhesive is high in curing speed; after a few seconds of ultraviolet irradiation, the acrylate double-bond group in the system can be quickly cured, so that the adhesive has preliminary bonding strength; and then by means of heating, the epoxy group is further subjected to crosslinking and curing according to a heat curing mechanism, thus further improving the bonding strength of the adhesive. The adhesive has high bonding strength and favorable conductivity, and can meet the bonding requirements of devices in electronic industry and the like. Besides, the adhesive disclosed by the invention is solventless, simple to operate, high in curing speed, high in bonding strength and suitable for batch production on a production line.

Description

[0001] technical field [0002] The invention belongs to the technical field of adhesives, and in particular relates to an ultraviolet light dual-curing conductive adhesive and a preparation method thereof. [0003] Background technique [0004] With the rapid development of electronic products, the electronics industry has put forward higher requirements for electronic packaging and bonding. At present, Pb / Sn solder, which is widely used in the fields of electronics and home appliances, has low cost, low melting point, high strength and good processing plasticity. , good wettability and so on. However, the shortcomings of Pb / Sn solder, such as high density, poor wettability with organic materials, and high connection temperature, cannot meet the requirements of the development of portable electronic products. In recent years, the use of new conductive adhesives to replace Pb / Sn solder connection materials has achieved extensive research and more and more applications in ...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): C09J175/14C09J9/02
Inventor 刘红波肖望东林峰
Owner YONGZHOU FUXING ELECTRONICS SCI & TECH
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