Fixing device assisting multi-wire cutting machine in cutting of silicon single crystal rods

Abstract

The invention relates to a fixing device assisting a multi-wire cutting machine in cutting of silicon single crystal rods. The fixing device is composed of an adhesive plate, an adhesive strip and a locking strip, wherein the upper surface of the adhesive plate is provided with a concave groove for accommodating the adhesive strip and the locking strip, two lateral walls of the adhesive strip are connected with corresponding lateral walls of the concave groove and the locking strip in a concave-convex embedded manner; and the locking strip is detachably fixed in the concave groove by fastening bolts. In the invention, as the adhesive strip and the adhesive plate are connected by means of the concave-convex embedded structure and the locking strip, the adhesion connection way in the prior art is changed, two procedures of adhesion and high-temperature degumming are omitted, the deformation problem of the adhesive plate is solved, the cost of glue is reduced, the phenomena that the adhesive strip degums, breaks, and drops off or rods fall in cutting process are avoided, the technical requirements on operators are decreased, and thus, simple assembly and firm connection are achieved and product quality can be improved very favorably.

Description

【Technical field】 [0001] The invention belongs to the field of cutting monocrystalline silicon rods, and in particular belongs to a device which is matched with a multi-wire cutting machine to fix the single crystal silicon rods and assist the multi-wire cutting machine to cut the single crystal silicon rods into silicon single wafers. 【Background technique】 [0002] When using multi-wire cutting single crystal silicon rods to obtain silicon single wafer technology, the multi-wire cutting machine needs an auxiliary device for fixing single crystal silicon rods. The device is composed of a bonding strip and a bonding plate, the bonding strip is a flat plate made of non-metallic material, the upper plane is used for bonding monocrystalline silicon rods, and the bottom plane is glued and fixed on the bonding board. Connect to the board. The bonding plate is fastened on the working platform of the cutting machine to realize the cutting and positioning of the monocrystalline sil...

AI Technical Summary

Problems solved by technology

This device has the following problems in practice: the connection method of the adhesive strip and the adhesive plate is glued, which is not only time-consuming and labor-intensive, but also has low efficiency and high cost of consumables. Moreover, as an adhesive plate that needs to be used repeatedly, there is a high-temperature degumming process.

In the process of degumming at high temperature, it is easy to cause deformation of the bonding board. Therefore, in the subsequent use of the bonding board, when it is fixed to the multi-wire cutting machine platform, it is easy to cause the adhesive strips that have been bonded on the bonding board to be damaged. Degumming, breakage, falling off, and even rod dropping during the cutting process, seriously endangering the safety of monocrystalline silicon rods and causing work accidents

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