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Method for cooling laptop, cooling system and efficiently cooled laptop

A notebook computer and heat dissipation method technology, applied in the direction of electrical digital data processing, instruments, digital data processing components, etc., can solve the problems of external heat dissipation and small cooling space of notebook computers, and achieve the effect of improving heat dissipation capacity

Inactive Publication Date: 2011-08-17
赵耀华 +1
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  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

[0003] A notebook computer heat dissipation method according to the present invention transmits a part of the heat emitted by the CPU or other heat-generating devices to other larger area areas of the notebook computer through a flat heat pipe array, so as to conduct heat dissipation through a larger area area that is very conducive to natural heat dissipation. Effective heat dissipation, which solves the problem that the internal heat dissipation space of the notebook computer is small and difficult to further dissipate the heat

Method used

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  • Method for cooling laptop, cooling system and efficiently cooled laptop
  • Method for cooling laptop, cooling system and efficiently cooled laptop
  • Method for cooling laptop, cooling system and efficiently cooled laptop

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Embodiment Construction

[0025] The present invention will be further described below in conjunction with the accompanying drawings.

[0026] The invention relates to a cooling system for a notebook computer, which is used for cooling the notebook computer. The schematic diagram of the cooling system is as follows: figure 1 as shown, figure 2 for figure 1 side view. The cooling system includes a first flat heat pipe 1, a second flat heat pipe 2 and a heat transfer structure 9, wherein the first flat heat pipe 1 and the second flat heat pipe 2 are flat heat pipes with multiple sets of micro heat pipe arrays, and the flat heat pipes It is a flat heat pipe formed by extruding and encapsulating a metal plate, and has one or a plurality of parallel heat pipes with an equivalent diameter of 0.3 mm to 2.5 mm. The evaporating section of the first flat heat pipe 1 is directly or indirectly attached to the CPU (shown in the mark 3) and other heat generating devices 4 in the notebook computer, and the conden...

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Abstract

The invention relates to a method for cooling a laptop, a cooling system and an efficiently cooled laptop. The cooling method comprises the following steps of: attaching an evaporation section of a first flat heat pipe directly or indirectly to a central processing unit (CPU) in the laptop or other heating device; connecting a condensation section of the first flat heat pipe with the evaporation section of a second flat heat pipe via a heat transmission structure for transmitting heat; and attaching the condensation section of the second flat heat pipe directly or indirectly to a cooling region of the laptop far from the CPU or other heating device, wherein both the first flat heat pipe and the second flat heat pipe are flat heat pipes with at least one group of micro-heat pipe arrays; the flat heat pipe is extruded and packaged through a metal sheet material and has one or more parallel micro heat pipes; and an equivalent diameter of the micro heat pipe is 0.3-2.5mm. By the method, the problem that the heat is hard to further dissipate due to the narrow cooling space inside the laptop is solved, and the cooing capacity of the laptop is improved.

Description

technical field [0001] The invention relates to a heat dissipation technology of a flat heat pipe, in particular to a heat dissipation method and a heat dissipation system for a notebook computer to dissipate heat through a display screen backplane, and a novel notebook computer using the heat dissipation system for efficient heat dissipation. Background technique [0002] Portable electronic products with heat-generating devices, such as notebook computers, are equipped with CPU or other heat-generating devices. With the continuous improvement of people's requirements for the performance of notebook computers and the continuous extension of continuous use time, the heat dissipation problem of CPU or other heat-generating devices has become more and more serious. more prominent. The heat dissipation problem of the notebook computer is a key factor related to the performance of the notebook computer. The traditional method is mainly a heat dissipation system composed of heat...

Claims

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Application Information

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IPC IPC(8): G06F1/20
Inventor 赵耀华张楷荣
Owner 赵耀华
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