Micro LHP radiating system for integrated electrofluid power pump

A technology integrating current and heat dissipation systems, applied in the field of micro LHP systems, can solve the problems of difficult to achieve high heat flux density heat dissipation, the working medium cannot be directional and stable circulation, etc. Effect

Inactive Publication Date: 2011-08-17
SOUTH CHINA UNIV OF TECH
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

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Problems solved by technology

[0006] The main purpose of the present invention is to solve the problem that the working medium in the current LHP cannot be directional and stable, and it is difficult to realize ...

Method used

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  • Micro LHP radiating system for integrated electrofluid power pump
  • Micro LHP radiating system for integrated electrofluid power pump
  • Micro LHP radiating system for integrated electrofluid power pump

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Embodiment

[0029] Such as figure 1 As shown, the miniature LHP heat dissipation system of the integrated electrohydrodynamic pump of the present invention includes an EHD evaporator 2 and an EHD condenser 8, and the EHD evaporator 2 and the EHD condenser 8 are connected through a steam pipeline 7 and a liquid pipeline 13; The EHD evaporator 2 is sequentially provided with a cover plate 6 with a liquid pipe interface, a capillary core 5, a high-voltage electrode 4, and an insulating partition 3, and the high-voltage electrode 4 and the insulating partition 3 are attached to each other and placed in the evaporator 2 The evaporating surface 14 (see figure 2 ), the capillary core 5 is attached to the inner surface of the cover plate 6; the capillary core 5 can be a porous metal sintered plate; the cover plate 6 is sealed with the EHD evaporator 2; the EHD condenser 8 is provided with A cover plate 12 with a liquid pipeline 13 interface, an insulating partition plate 11 with holes, a high-v...

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Abstract

The invention discloses a micro loop heat pipe (LHP) radiating system for an integrated electrofluid power pump. The system comprises an electrohydrodynamic (EHD) evaporator, an EHD condensator, a steam pipeline, a liquid pipeline and the like. A high-voltage electrode and a porous metal sintering plate which are separated by using an insulating partition plate and are parallel to an evaporation plane are arranged in the EHD evaporator, wherein the high-voltage electrode is used for reinforcing the evaporation and the heat transfer of the evaporator; and the porous metal sintering plate can improve the reflowing speed of a liquid working medium. The evaporator has the advantages of small size, compact structure, no mechanical power and the like. A machining column with a roughened surfaceand a high-voltage electrode are arranged in the EHD condensator, wherein the machining column can accelerate the condensing speed of steam; and the high-voltage electrode improves the pumping efficiency of the liquid working medium. Therefore, the condensation and heat exchange efficiency of the micro LHP is greatly improved. The radiating system can fully and immediately cool electronic components and parts with high-heat flux density, thereby meeting radiating requirements on high-performance micro electronic components and parts.

Description

technical field [0001] The invention relates to a micro-LHP heat dissipation system for microelectronic equipment, in particular to a micro-LHP heat dissipation system used as an integrated electrohydrodynamic pump under the condition of high heat flux of microelectronics. Background technique [0002] With the rapid development of high-frequency, high-speed and integrated circuit technology of various electronic devices and equipment and the progress of micro-electro-mechanical technology, such as computer chips, etc. are developing towards high performance, miniaturization and miniaturization, making the unit volume of electronic devices The calorific value and heat flux density are increasing rapidly, and there are more and more constraints on the layout and design of heat dissipation devices. How to achieve heat dissipation with high heat flux density in a limited space has become the focus of space thermal control technology issues. Taking computer CPU as an example, th...

Claims

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Application Information

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IPC IPC(8): H01L23/473H01L23/36
Inventor 万珍平徐燕小
Owner SOUTH CHINA UNIV OF TECH
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